Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Synthesis process of viscosified phenyl silicone oil for high-power light-emitting diode (LED) packaging

A technology of LED encapsulation and phenyl silicone oil, which is applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of relying on imports of silica gel for high-power LED encapsulation, not being able to meet the needs of power LED encapsulation, and being expensive, and achieve good room temperature Curing performance, improvement of light output and high temperature resistance, and effect of improving adhesion

Inactive Publication Date: 2015-09-09
INST OF CHEM MATERIAL CHINA ACADEMY OF ENG PHYSICS
View PDF5 Cites 7 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the original epoxy resin or modified epoxy resin cannot meet the packaging needs of power LEDs.
At present, my country's LED packaging accounts for about 75% of the world's total. The silica gel used for high-power LED packaging is all dependent on imports, and the price is expensive, which seriously restricts the development of my country's related industrial revolution.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Synthesis process of viscosified phenyl silicone oil for high-power light-emitting diode (LED) packaging

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] A. Synthesis of epoxy end-capping agent: take a four-necked flask, set a condenser, a nitrogen conduit, and a built-in thermometer; put allyl glycidyl ether and platinum catalyst into the four-necked flask according to the molar ratio of 1:0.001:0.45 , put 1,1,3,3-tetramethyldisiloxane in the dropping funnel, and add allyl glycidyl ether, platinum catalyst and 1,1,3,3-tetramethyldisiloxane into the four-necked flask Toluene, which is twice the total mass of methyldisiloxane, is used as a solvent; 1,1,3,3-Tetramethyldisiloxane is dropped at a rate of 5 drops per minute at a temperature of 65°C under nitrogen protection. Add it into a four-neck flask, after the dropwise addition, raise the temperature to 95°C for 10 hours, then heat up and distill, the component distilled at 195°C is the epoxy end-capping agent 1,1,3,3-tetramethyl- 1,3 Bis[3-(oxiranylmethoxy)propyl]disiloxane; 95% yield.

[0030] B. Dewatering of raw materials: According to the application field of pheny...

Embodiment 2

[0035] A. Synthesis of epoxy end-capping agent: Take a four-necked flask, set a condenser, a nitrogen conduit, and a built-in thermometer; put allyl glycidyl ether and platinum catalyst into the four-necked flask according to the molar ratio of 1:0.01:0.5 , put 1,1,3,3-tetramethyldisiloxane in the dropping funnel, and add allyl glycidyl ether, platinum catalyst and 1,1,3,3-tetramethyldisiloxane into the four-necked flask Toluene twice the total mass of methyldisiloxane is used as solvent; 1,1,3,3-Tetramethyldisiloxane is dropped at a rate of 7 drops per minute at a temperature of 60°C under nitrogen protection conditions Add it into a four-necked flask, after the dropwise addition, raise the temperature to 100°C to react for 8 hours, then heat up and distill, the component distilled at 200°C is the epoxy end-capping agent 1,1,3,3-tetramethyl- 1,3 Bis[3-(oxiranylmethoxy)propyl]disiloxane; 75% yield.

[0036] B. Dewatering of raw materials: According to the application field of...

Embodiment 3

[0041] A. Synthesis of epoxy end-capping agent: take a four-necked flask, set a condenser, a nitrogen conduit, and a built-in thermometer; put allyl glycidyl ether and platinum catalyst into the four-necked flask according to the molar ratio of 1:0.005:0.40 , put 1,1,3,3-tetramethyldisiloxane in the dropping funnel, and add allyl glycidyl ether, platinum catalyst and 1,1,3,3-tetramethyldisiloxane into the four-necked flask Toluene, which is twice the total mass of methyldisiloxane, is used as a solvent; 1,1,3,3-Tetramethyldisiloxane is dropped at a rate of 5 drops per minute at a temperature of 70°C under nitrogen protection. Add it into a four-neck flask, after the dropwise addition, raise the temperature to 97°C for 10 hours, then heat up and distill, the component distilled at 180°C is the epoxy-capping agent 1,1,3,3- 1,3 Bis[3-(oxiranylmethoxy)propyl]disiloxane; 88% yield.

[0042] B. Dewatering of raw materials: According to the application field of phenyl silicone oil, ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a synthesis process of viscosified phenyl silicone oil for high-power light-emitting diode (LED) packaging. The synthesis process comprises the following steps of: synthesizing an epoxy end-capping reagent; dehydrating a methyl cyclosiloxane monomer, a methyl vinyl cyclosiloxane monomer and methyl phenyl cyclosiloxane monomer; adding the epoxy end-capping reagent and a catalyst and performing polymerization reaction; and after the reaction, removing the catalyst and performing vacuum devolatilization; and cooling and discharging. Compared with the traditional silicone oil for LED packaging, the viscosified phenyl silicone oil for high-power LED packaging synthesized by the synthesis process has high refractive index and light transmittance, excellent viscosity and excellent room temperature curing property, and can effectively improve the light output and the high temperature resistance of silica gel for LED packaging.

Description

technical field [0001] Embodiments of the present invention relate to the field of high-power LED packaging, and more specifically, embodiments of the present invention relate to a synthesis process of phenyl silicone oil for thickening high-power LED packaging. Background technique [0002] With the implementation of the national new energy strategy, the development and application of new energy materials has become one of the key research directions in the 21st century. As the link most closely related to the market in the LED industry chain, LED packaging materials have always been a research hotspot in the new energy materials industry. With the development of power LED devices, the requirements for the optical properties (refractive index, light transmittance, etc.) of LED packaging materials are getting higher and higher. At the same time, the packaging materials are required to have high hardness, excellent high temperature resistance and good bonding performance. Wa...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C08G77/20C08G77/06H01L33/56
Inventor 邓志华付俊杰邓建国纪兰香尚丽坤刘忠平马春彦黄健
Owner INST OF CHEM MATERIAL CHINA ACADEMY OF ENG PHYSICS
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com