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Intelligent card and manufacturing method thereof

A manufacturing method and technology for smart cards, applied in the field of electronics, can solve problems such as limiting the wiring of the main circuit board

Active Publication Date: 2015-09-02
FEITIAN TECHNOLOGIES
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The invention provides a smart card and its manufacturing method, which is used to solve the defect that the contacts on the surface of the smart card limit the wiring of the main circuit board in the prior art

Method used

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  • Intelligent card and manufacturing method thereof
  • Intelligent card and manufacturing method thereof

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Embodiment Construction

[0096] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0097] The embodiment of the present invention provides a kind of manufacturing method of smart card, such as figure 1 shown, including the following steps:

[0098] Step 101, assembling the security chip on the module circuit board to obtain the security chip module.

[0099] Specifically, the security chip module can be obtained by assembling the security chip on the module circuit board through cooperation between pins of the security chip and internal pad...

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Abstract

The invention discloses an intelligent card and a manufacturing method thereof. The method includes the following steps that a safety chip is assembled to a module circuit board to obtain a safety chip module, and one of the layers of the module circuit board is provided with a plurality of mutually insulated contacts; a solder ball is arranged on the pad of the safety chip of a main circuit board, a groove is milled in a substrate filled with the main circuit board based on the position of the pad of the safety chip of the main circuit board to make the solder ball on the pad of the safety chip visible at the bottom of the groove; and the safety chip module fills the groove and is assembled to the main circuit board through the solder ball on the pad of the safety chip. The safety chip is assembled to the module circuit board with the plurality of contacts, the obtained safety chip module is assembled to the main circuit board as a whole, so that the limitation to the wiring of the main circuit board caused by the contacts on the surface of an intelligent card is reduced, and the wiring quality of the main circuit board is improved.

Description

technical field [0001] The invention relates to the field of electronic technology, in particular to a smart card and a manufacturing method thereof. Background technique [0002] With the development of electronic technology, smart cards are widely used in many industries such as finance, transportation, communication, commerce, education, medical care, social security, tourism and entertainment by virtue of their advantages of large amount of stored information and high security. The smart card performs data encryption and decryption through its internal security chip, and performs data interaction with the card reader terminal through the contacts on the card surface. [0003] In the existing smart card packaging process, the above-mentioned contacts are usually welded to the main circuit board of the smart card, and each contact is connected to the security chip through wires on the main circuit board. [0004] In the process of realizing the present invention, the inve...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06K19/077
Inventor 陆舟于华章
Owner FEITIAN TECHNOLOGIES
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