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Quasi-differential-capacitor type MEMS pressure sensor and manufacturing method thereof

一种压力传感器、电容式的技术,应用在传感器领域,能够解决易受到电磁干扰、分辨率降低、压力传感器输出信号不稳定等问题,达到提高稳定性及分辨率的效果

Active Publication Date: 2015-08-19
GOERTEK MICROELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since this kind of capacitive MEMS pressure sensor uses a single capacitor for external air pressure detection, it is vulnerable to common-mode interference such as electromagnetic interference, which will cause the output signal of the pressure sensor to be unstable and the resolution will be reduced, which will lead to a decrease in the performance of the chip.

Method used

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  • Quasi-differential-capacitor type MEMS pressure sensor and manufacturing method thereof
  • Quasi-differential-capacitor type MEMS pressure sensor and manufacturing method thereof
  • Quasi-differential-capacitor type MEMS pressure sensor and manufacturing method thereof

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Embodiment Construction

[0033] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangements of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.

[0034] The following description of at least one exemplary embodiment is merely illustrative in nature and in no way taken as limiting the invention, its application or uses.

[0035] Techniques, methods and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such techniques, methods and devices should be considered part of the description.

[0036] In all examples shown and discussed herein, any specific values ​​should be construed as exemplary only, and not as limitations. Therefore, other instances of the exemplary embodiment may have dif...

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Abstract

The invention discloses a quasi-differential-capacitor type MEMS pressure sensor and a manufacturing method thereof. The quasi-differential-capacitor type MEMS pressure sensor comprises a first lower electrode (3a), a second lower electrode (3b), a first upper electrode (4a), and a second upper electrode (4b), wherein the first upper electrode (4a) and the second upper electrode (4b) are supported corresponding above the first lower electrode (3a) and the second lower electrode (3b). The first upper electrode (4a) is a pressure sensitive film. A cavity formed between the first upper electrode (4a) and the first lower electrode (3a) is a sealed cavity (9a), so that the first upper electrode (4a) and the first lower electrode (3a) form an air-pressure-sensitive capacitor and the second upper electrode (4b) and the second lower electrode (3b) form a reference capacitor with the electric capacity not changing with the external air pressure. According to the invention, with the pressure capacitor, a common-mode interference signal in an output signal of the air-pressure-sensitive capacitor can be at least filtered partially, thereby improving the stability and resolution of the output signal of the air-pressure-sensitive capacitor.

Description

technical field [0001] The invention relates to the field of sensors, more specifically, to a quasi-differential capacitive MEMS pressure sensor and a manufacturing method thereof. Background technique [0002] The capacitive MEMS pressure sensor is a sensor that uses the capacitance between the pressure-sensitive layer as the upper electrode and the lower electrode to characterize the pressure value acting on the pressure-sensitive layer. Existing capacitive MEMS pressure sensors usually use a single capacitor for pressure detection, such as figure 1 As shown, it includes a substrate 1', an insulating layer 2' formed on the substrate 1', a lower electrode 3' formed on the insulating layer 2', and the pressure on the lower electrode 3' supported by a supporting part 7' Sensitive film, the lower electrode 3' is electrically connected to the lower electrode pad 5', and the pressure sensitive film is used as the upper electrode 4' to be electrically connected to the upper elec...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01L9/12
CPCG01L9/0045G01L9/0072G01L13/025G01L19/0618G01L9/12
Inventor 郑国光
Owner GOERTEK MICROELECTRONICS CO LTD
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