Tensile heat-radiating graphite patch

Abstract

The invention discloses a tensile heat-radiating graphite patch. A release material layer is attached to a surface, away from a graphite layer, of a heat conduction adhesive layer. The graphite layer is prepared by the following process: respectively coating the upper and lower surfaces of a polyimide film with a layer of graphite modifier to obtain a polyimide film after processing, wherein the viscosity of the graphite modifier is 30000-48000CP; heating the polyimide film after processing from room temperature to 1180-1250 DEG C and cooling the polyimide film to obtain a pre-fired carbonized film; calendaring the pre-fired carbonized film in step 4 by a calendaring machine; heating the pre-fired carbonized film to 2850-2950 DEG C to obtain a fired graphite film; and calendaring the fired carbonized film obtained in step 4 to obtain the graphite layer. Uniform heat conduction performance is achieved, and meanwhile, the radiating performance, stability and reliability of products are improved, and the cost of products is greatly reduced.

Description

technical field [0001] The invention relates to a stretch-resistant and heat-dissipating graphite patch, which belongs to the technical field of graphite sheets. Background technique [0002] With the rapid development of modern microelectronics technology, electronic devices (such as laptops, mobile phones, tablet computers, etc.) are increasingly becoming ultra-thin and lightweight. This structure makes the internal power density of electronic devices significantly increased, and the heat generated during operation is not easy to discharge , Easy to accumulate rapidly and form high temperature. On the other hand, high temperatures can reduce the performance, reliability and lifespan of electronic equipment. Therefore, the current electronics industry has put forward higher and higher requirements for heat dissipation materials as the core components of thermal control systems, and there is an urgent need for a highly efficient heat-conducting, lightweight material to quic...

AI Technical Summary

Problems solved by technology

[0003] In the prior art, polyimide films are mostly used for flexible circuit boards. Although polyimide films are sintered to obtain graphite heat sinks, which can be pasted on heat sources, they are limited by the quality and quality of polyimide films. The performance is uneven, which affects the heat dissipation performance of the heat dissipation double-sided film. There are the following technical problems: uneven heat dissipation, prone to local overheating of the tape, improved product heat dissipation performance instability, poor reliability performance, and is not conducive to product quality control. affect product competitiveness

Images