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Sample transfer and mask device for thin-film deposition equipment system

A sample transfer and film deposition technology, applied in ion implantation plating, gaseous chemical plating, coating, etc., can solve the problems of lack of film coverage, inability to form a material database, unevenness, etc.

Active Publication Date: 2015-07-29
嘉善县国创新能源研究院
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

On the one hand, since the mask has a certain thickness, when multi-level mask is used for layer-by-layer deposition, if the pattern dislocation of the mask pattern of each level occurs, and the shadowing effect at the edge of the array pattern will cause the film coverage to be missing or not uniform, resulting in the inability to form the desired material database

Method used

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  • Sample transfer and mask device for thin-film deposition equipment system
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  • Sample transfer and mask device for thin-film deposition equipment system

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Embodiment Construction

[0030] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0031] The specific implementation manner of the present invention will be further described in detail below in conjunction with the schematic diagrams.

[0032] Such as figure 1 , figure 2 and Figure 4 As shown, a sample transfer and mask device for thin film deposition equipment system, including mask plate transfer device 1, mask plate 2, detachable sample holder 3, baffle plate 4, cooling water pipe 5, sample transfer rod 6 And the fixed inserting plate 21...

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Abstract

The invention relates to configuration of high-vacuum and ultrahigh-vacuum equipment systems, in particular to a sample transfer and mask device for a thin-film deposition equipment system. The sample transfer and mask device comprises a mask plate transfer device, a mask plate, a detachable sample tray, a baffle, a cooling water pipe and a sample transfer rod, wherein the device is integrated with thin-film deposition equipment and is in a complete sealed state, and the high-vacuum or ultrahigh-vacuum state of the equipment system is not required to be interrupted during loading and unloading of a sample; the sample can be conveniently and reliably fixed, cannot fall when a sample table rotates in site or moves relatively in the technological process and cannot be influenced by the technological process such as thermal radiation during in-site high-temperature annealing; the position of the mask plate relative to the sample table can be adjusted accurately, and whether the mask plate and the sample, namely a clamp, are separated or attached can be accurately controlled; the mask plate can perform positioned displacement relative to the sample table and can also perform continuous displacement; the mask plate and motion control of the mask plate cannot be influenced by the high-temperature process.

Description

technical field [0001] The invention relates to the configuration of high-vacuum and ultra-high-vacuum equipment systems, in particular to a sample delivery and masking device for thin-film deposition equipment systems. Background technique [0002] Driven by Moore's law, the size of semiconductor microelectronic devices is shrinking exponentially to the nanometer scale. High-vacuum and ultra-high-vacuum thin film deposition preparation has become an essential means of modern semiconductor microelectronics and ultra-micro-integrated circuit technology. In order to achieve continuous operation in high vacuum and ultra-high vacuum, avoid contamination of the film deposition process, and improve work efficiency, a sample transfer system is usually used to transfer samples step by step from the atmospheric atmosphere to the high vacuum and ultra-high vacuum chambers. [0003] High-throughput combined semiconductor material chip synthesis technology, through the deposition of th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/04C23C16/04
Inventor 茆胜朱煜张令辉张耀辉
Owner 嘉善县国创新能源研究院
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