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Thermal conductive adhesive composition for measuring temperature of cable and application method of thermal conductive adhesive composition

A technology of heat-conducting adhesives for temperature measurement, applied in the direction of adhesive types, adhesive additives, ester copolymer adhesives, etc., can solve the problems of long response time of temperature measurement, small contact area, decreased sensitivity, etc., and achieve good Heat insulation, large contact area for temperature measurement, and increased sensitivity

Inactive Publication Date: 2015-07-08
ZHONGSHAN POLYTECHNIC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The common method of existing cable temperature measurement is to tie the probe and the target area together with objects such as plastic ropes, the contact area is small, and the temperature measurement response time is long, resulting in a decrease in sensitivity

Method used

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  • Thermal conductive adhesive composition for measuring temperature of cable and application method of thermal conductive adhesive composition
  • Thermal conductive adhesive composition for measuring temperature of cable and application method of thermal conductive adhesive composition
  • Thermal conductive adhesive composition for measuring temperature of cable and application method of thermal conductive adhesive composition

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Experimental program
Comparison scheme
Effect test

preparation example Construction

[0033] The preparation method of acrylate resin solution is:

[0034] First put 1 / 3~1 / 2 organic solvent into the reaction kettle, and raise the temperature to 85±2°C, while controlling the stirring speed at 100~700rpm, and then completely dissolve each acrylic acid monomer and initiator in the remaining organic solvent , and then drop it into the reactor at a rate of 2 to 6 seconds per drop. After the drop is completed, keep it warm for 3 to 6 hours, stop the reaction, and discharge it at room temperature;

[0035] The organic solvent among the present invention is preferably one or more in ethyl acetate, butyl acetate, acetone, butanone, xylene.

[0036] The heat-conducting inner glue is prepared by fully stirring 70-100 parts of acrylate resin solution, 20-50 parts of heat-conducting powder and 1-15 parts of additives, wherein the average particle size of the heat-conducting powder is not greater than 6 microns;

[0037] The sealing and heat-insulating outer glue is prepare...

Embodiment 1

[0042] Prepare the Acrylate Resin Solution

[0043] Put 1 / 3 of the organic solvent into the reaction kettle according to the following proportions by weight, and raise the temperature to 85±2°C, while controlling the stirring speed to 100rpm, and then completely dissolve each acrylic acid monomer and initiator in the remaining organic solvent , and then drop it into the reaction kettle at a rate of 2 to 6 seconds per drop. After the dropwise addition, keep it warm for 3 hours, stop the reaction, and discharge it at room temperature:

[0044]

[0045]

Embodiment 1-1

[0048] a. Preparation of thermal inner glue

[0049] Fully stir 70 parts of acrylate resin solution, 20 parts of silver powder and 1 part of coupling agent KH550 evenly;

[0050] b. Preparation of sealing and heat insulating outer glue

[0051] Mix 70 parts of acrylate resin solution, 30 parts of nano-scale ATO and 1 part of curing agent melamine fully and evenly.

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Abstract

The invention discloses a thermal conductive adhesive composition for measuring temperature of a cable and an application method for the thermal conductive adhesive composition. The composition is prepared from an internal thermal conductive adhesive and an external sealed insulating adhesive, wherein the internal thermal conductive adhesive and the external sealed insulating adhesive are mainly prepared from an acrylate resin solution. When the composition is applied, the application method comprises the following steps: firstly, coating a target region of which the temperature needs to be measured with the internal thermal conductive adhesive, wherein the thickness of the internal thermal conductive adhesive is not smaller than the diameter of a probe of a temperature measurement system; embedding the probe into the internal thermal conductive adhesive; standing at a room temperature until the internal thermal conductive adhesive is dried; and coating the surfaces of the probe and the target region with the external sealed insulating adhesive, controlling the thickness of the external sealed insulating adhesive to be not smaller than 2 microns, and drying. The probe and a temperature measuring target are firmly bound together by virtue of the internal thermal conductive adhesive with excellent heat-conducting property; the contact area for temperature measurement of the cable is large; the temperature measurement sensitivity is increased; and the surfaces of the internal thermal conductive adhesive and the probe are coated with a layer of external sealed insulating adhesive, so that the effects of insulating heat and preventing wind and rain from affecting temperature measurement are achieved.

Description

【Technical field】 [0001] The invention relates to a heat-conducting adhesive composition for cable temperature measurement and an application method thereof. 【Background technique】 [0002] The common method of existing cable temperature measurement is to tie the probe and the target area together with objects such as plastic ropes. The contact area is small, and the temperature measurement response time is long, resulting in a decrease in sensitivity. 【Content of invention】 [0003] The purpose of the present invention is to overcome the defects of the prior art, and provide a heat-conducting adhesive composition for cable temperature measurement that can firmly bond the probe and the cable, has high sensitivity and stable temperature measurement effect. [0004] Another object of the present invention is to provide an application method of the composition. [0005] In order to achieve the above object, the present invention adopts the following technical solutions: [...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J133/12C09J133/08C09J11/04C08F220/14C08F220/18C08F220/06C08F212/08C08F220/28
Inventor 冷小冰聂建华
Owner ZHONGSHAN POLYTECHNIC
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