Thermoelectric device using substrate and method for manufacturing same

Abstract

The present invention relates to a thermoelectric device and a method for manufacturing the same, characterized in that a thermoelectric substance is formed on a mesh-type substrate made of a glass fiber or the like. According to the present invention, the thermoelectric substance is supported by the substrate, without a substrate formed by alumina or the like, such that, in addition to being lightweight, heat loss by the substrate is minimized, thereby maximizing thermoelectric efficiency.

Description

technical field [0001] The present invention relates to a thermoelectric device and a manufacturing method thereof, and more particularly, to a thermoelectric device using a substrate made of glass fiber or the like and a manufacturing method thereof. Background technique [0002] The thermoelectric effect generally refers to an effect in which thermal energy and electric energy are mutually exchanged, that is, the Seebeck effect discovered by Thomas Seebeck and the Peltier effect discovered by Peltier, and devices using the thermoelectric effect are generally called thermoelectric device. [0003] Thermoelectric devices include thermoelectric power generation devices using the Seebeck effect (in which electromotive force is generated by a temperature difference) and cooling devices using the Peltier effect that absorbs heat (or When an electric current is applied, heat is generated). [0004] Thermoelectric devices in the prior art are generally fabricated in a structure ...

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Problems solved by technology

[0006] However, in the thermoelectric device 100 of the prior art, since a substrate such as alumina (Al2O3) is generally used as the lower substrate 110 and the upper substrate 160, its weight is relatively large and it is not suitable for use in the field of thermoelectric devices requiring light weight. , such as the human body, vehicles, airplanes, and space shuttles, and the heat loss through the upper and lower substrates is large, and as a result, the thermoelectric efficiency decreases

In addition, in recent years, with the development of technologies such as wearable computers, interest in thermoelectric devices with flexible characteristics has been increasing, but since the thermoelectric device 100 in the prior art does not have flexible characteristics, the application range of the device is narrow

[0007] In recent years, a technology of forming a thermoelectric device on a flexible substrate such as a polyethylene terephthalate (PET) film is disclosed by Korean Patent Application Publication No. 2012-0009161, but this technology also has the problem that due to Still using a substrate, there are limitations in weight reduction and larger heat losses through the substrate, thus reducing the efficiency of the thermoelectric device

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