Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Technological process changing method and method for monitoring changed technological process

A technology for process flow and parameter change, which is applied in the field of monitoring the changed process flow, and in the field of process flow change, can solve the problems of extensive changes in various parameters or processes, complex semiconductor process flow, and reduced product yield, etc. Achieve the effect of improving production efficiency, reducing process impact, and improving production efficiency

Active Publication Date: 2015-07-01
SEMICON MFG INT (SHANGHAI) CORP
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, the process flow of semiconductors is extremely complex, and the methods of changing various parameters or processes are relatively extensive. The existing technology only artificially selects batches to change the process flow of the wafers, and then verifies and confirms the test results of the changed process flow. Change it again to get the desired effect
This batch change method is difficult to take into account the processes involved in the batch selection and the range of influence between the processes. Artificially changing the batch selection of the wafers will greatly increase the repetition rate and change cost of the process flow. In particular, erroneous changes will also reduce the yield rate of the product, resulting in low production efficiency

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Technological process changing method and method for monitoring changed technological process
  • Technological process changing method and method for monitoring changed technological process
  • Technological process changing method and method for monitoring changed technological process

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0068] A change method for a process flow, based on at least one change request, such as figure 1 shown, including:

[0069] Step S100, pre-batching the wafer groups.

[0070] As a result of pre-batching wafers, several wafer lots are obtained. A wafer lot is formed by merging one or more wafers to pass through a series of manufacturing tools and finally be fabricated into an integrated circuit. Each fabrication tool is usually assigned to a designated wafer lot to perform a single wafer fabrication operation. For example, a specific fabrication tool can perform layering, patterning, doping or thermal treatment on a wafer. Each fabrication tool executes wafer fabrication operations according to defined operating procedures. The process flow referred to in this embodiment may include the execution of the above-mentioned manufacturing operations.

[0071] The change application may be received by a process flow management system or a graphical user interface, and implemente...

Embodiment 2

[0115] A change method for a process flow, based on at least one change request, such as Figure 9 shown, including:

[0116] In step S200, the wafer group is pre-batched to obtain several wafer batches.

[0117] The specific implementation manner of this step can refer to embodiment 1.

[0118] Step S201 , selecting wafer batches applicable to the change application according to the current change application.

[0119] The selection method of the wafer lot applicable to the change application can refer to Embodiment 1. This embodiment also classifies the wafer lot, that is, the wafer lot includes the wafer lot of the first change level and Wafer lots of the second modification level.

[0120] Step S202, the wafers in the wafer lot include reference wafers and wafers applicable to the change application, and select the change wafers from the wafers applicable to the change application in the selected wafer batch applicable to the change application .

[0121] Different fr...

Embodiment 3

[0134] A change method for a process flow, based on at least one change request, such as Figure 11 shown, including:

[0135] In step S300, the wafer group is pre-batched to obtain several wafer batches.

[0136] In step S301, the type of the wafer lot includes the wafer lot of the first modified level, the wafer lot of the second modified level and the wafer lot of the third modified level, based on the type of the wafer lot from the applicable Select the changed wafers from the wafer lot of the above-mentioned change application.

[0137] This embodiment searches for wafer batches that are applicable to the current modification application based on the modification information in the modification application or the modification application form, wherein the modification information includes the classification of the wafer batches, and this embodiment provides the Another classification method for wafer batches, this classification method combines the type assignment of wa...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a technological process changing method and a method for monitoring a changed technological process. The technological process changing method comprises the steps of pre-batching wafer groups to obtain a plurality of wafer batches; selecting the wafer batches applicable to changing application according to current change application, wherein wafers in the wafer batches include standard wafers; selecting changed wafers in the selected wafer batches applicable to the changing application except the standard wafers so as to obtain a wafer batching result; executing a technological process based on the wafer batching result. By means of the technological process changing method, change repeating rate and change cost of the technological process can be reduced.

Description

technical field [0001] The invention relates to the field of integrated circuit manufacturing, in particular to a method for changing a process flow and a method for monitoring the changed process flow. Background technique [0002] In the production and manufacture of integrated circuits, each wafer (Wafer) needs to go through hundreds or even thousands of processes from raw materials to final products, and all the processes that the wafer passes through constitute the process flow. Under normal circumstances, the wafer executes each process step by step according to the preset process flow, that is to say, the content of each process in the process flow is preset, and the content of each process also includes the specific process. The parameters also pre-set the time sequence for the execution of each process, and the process flow drive engine controls the chip to execute each process in sequence according to the pre-set process flow. [0003] However, with the complexity...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G06Q10/06G06Q50/04
CPCY02P90/30
Inventor 郭腾冲刘萍
Owner SEMICON MFG INT (SHANGHAI) CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com