A high-throughput dna sequencing chip
A DNA sequencing, high-throughput technology, applied in biochemical instruments, biochemical equipment and methods, enzymology/microbiology devices, etc., can solve the problems of low accuracy and low sequencing throughput, and achieve high sensitivity and simple detection , the effect of large effective area
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment 1
[0012] A high-throughput DNA sequencing chip, the chip is 49 mm long, 48 mm wide, and 2 mm thick. The chip is equipped with 680,000 to 690,000 reaction pools, the diameter of which is 30 μm, and a top cover on the top of the reaction pool. The material is optical fiber, and the effective area of the chip is 27.6x27.6mm 2 . Chips were fabricated using the Infinium chip fabrication method.
Embodiment 2
[0014] A high-throughput DNA sequencing chip. The chip is 49mm long, 48mm wide, and 2mm thick. The chip is equipped with 690,000 to 700,000 reaction pools. The diameter of the reaction pool is 29 μm. There is an upper cover on the top of the reaction pool. The material is quartz, and the effective area of the chip is 27.6x27.6mm 2 . Chips were fabricated using the Infinium chip fabrication method.
Embodiment 3
[0016] A high-throughput DNA sequencing chip with a length of 49mm, a width of 48mm, and a thickness of 2mm. The chip is equipped with 700,000 to 710,000 reaction pools, the diameter of which is 28.5 μm, and an upper cover on the top of the reaction pool. The material is optical fiber, and the effective area of the chip is 27.6x27.6mm 2 . Chips were fabricated using the Infinium chip fabrication method.
PUM
Property | Measurement | Unit |
---|---|---|
area | aaaaa | aaaaa |
diameter | aaaaa | aaaaa |
thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com