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A preparation method for filling SN-based solder paste with micro-nano copper particles for high-temperature packaging of electronic modules

An electronic module, micro-nano technology, applied in the field of materials, can solve problems such as affecting the reliability of solder joints, achieve huge development potential and application prospects, controllable copper and tin, and enhance the performance of solder joints

Active Publication Date: 2016-10-05
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

With the prolongation of thermal aging time, the Kirkendall pores will gradually grow, aggregate and along the Cu / Cu 3 Sn interface forms delamination or induces Cu 3 Initiation of internal cracks in Sn, which directly affects the reliability of solder joints

Method used

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  • A preparation method for filling SN-based solder paste with micro-nano copper particles for high-temperature packaging of electronic modules
  • A preparation method for filling SN-based solder paste with micro-nano copper particles for high-temperature packaging of electronic modules
  • A preparation method for filling SN-based solder paste with micro-nano copper particles for high-temperature packaging of electronic modules

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specific Embodiment approach 1

[0033] Specific implementation mode one: as Figure 1-3 As shown, this embodiment describes the present invention in detail in conjunction with the specific method for preparing Sn-based solder paste filled with micro-nano copper particles with a copper-tin ratio of 6:5:

[0034] Step 1: React CuCl 2 and complexing agent sodium citrate placed in a reaction beaker, dissolved in ethanol solution.

[0035] Step 2: Prepare a reducing agent solution, the reducing agent is sodium borohydride or hydrazine hydrate, and the ratio of the amount of the reducing agent to the amount of copper and tin is 5:1.

[0036] Step 3: Use a peristaltic pump to add the reducing agent solution to CuCl 2 In the solution, the adding rate is 0.5~1mL / s, and stand for 5 minutes after the reaction is complete.

[0037] Step 4: Weigh the corresponding SnCl according to the copper-tin ratio of 6:5 2 Drugs, and dissolved in ethanol solution.

[0038] Step 5: Use a peristaltic pump to transfer SnCl 2 The ...

specific Embodiment approach 2

[0044] Specific embodiment two: This embodiment describes the present invention in detail in conjunction with the specific method for preparing Sn-based solder paste filled with micro-nano copper particles with a copper-to-tin ratio of 3:1:

[0045] Step 1: React CuSO 4 and complexing agent citric acid are placed in a reaction beaker and dissolved in acetone solution.

[0046] Step 2: Configure the reducing agent solution, the reducing agent is sodium borohydride or TiCl 4 , the ratio of the amount of reducing agent to the amount of copper and tin is 10:1.

[0047] Step 3: Add the reducing agent solution to CuSO using a peristaltic pump 4 In the solution, the rate of addition is 2~4mL / s, and the reaction is completed and left to stand for 10 minutes.

[0048] Step 4: Weigh the corresponding SnSO according to the copper-tin ratio of 3:1 4 Drugs, and dissolved in acetone solution.

[0049] Step 5: Use a peristaltic pump to transfer SnSO 4 The solution is added to the solut...

specific Embodiment approach 3

[0055] Specific embodiment three: This embodiment describes the present invention in detail in conjunction with a specific method for preparing Sn-based solder paste filled with micro-nano copper particles with a copper-tin ratio of 2:1:

[0056] Step 1: React CuSO 4 and complexing agent citric acid are placed in a reaction beaker and dissolved in acetone solution.

[0057] Step 2: Configure the reducing agent solution, the reducing agent is selected as hydrazine hydrate or TiCl 4 , the ratio of the amount of reducing agent to the amount of copper and tin is 10:1.

[0058] Step 3: Add the reducing agent solution to CuSO using a peristaltic pump 4 In the solution, the rate of addition is 1~3mL / s, and after the reaction is complete, let it stand for 5 minutes.

[0059] Step 4: Weigh the corresponding SnSO according to the copper-tin ratio of 2:1 4 Drugs, and dissolved in acetone solution.

[0060] Step 5: Use a peristaltic pump to transfer SnSO 4 The solution is added to t...

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Abstract

The invention discloses a micro-nano copper particle filled Sn based soldering paste for high-temperature packaging of an electronic module and a preparation method of soldering paste. The micro-nano copper particle filled Sn based soldering paste is prepared from the following components in parts by mass: 80 to 90 parts of copper tin micro-nano particles, 2 to 8 parts of dispersing agent, 2 to 8 parts of soldering flux, and 2 to 8 parts of thixotropic agent; the micro-nano copper and micro-nano tin are sequentially reduced by the direct liquid phase multi-element sequential controllable reduction method; meanwhile, the copper tin micro-nano particles are highly uniformly mixed; the prepared mixed copper tin micro-nano particles are mixed with the dispersing agent, the soldering flux and the thixotropic agent and then prepared into the soldering paste by the mixed loading dispersing process. According to the method, the micro-nano copper particles are prepared by the direct liquid phase multi-element sequential controllable reduction method; the method of directly secondarily preparing the micro-nano tin particles in the copper particle containing reacting liquid is utilized to prepare the micro-nano copper particle filled Sn based soldering paste; the method has the advantages of being simple, high in production efficiency, wide in applicable process range, controllable of copper and tin of the soldering paste, and matching with the traditional packaging process.

Description

technical field [0001] The invention belongs to the technical field of materials, and relates to a copper-tin mixed solder paste and a preparation method thereof, in particular to a kind of packaging or assembly of electronic modules. The prolongation of the service time is gradually enhanced, and the micro-nano copper particle-filled Sn-based solder paste and the preparation method thereof are matched with the current packaging process. Background technique [0002] After entering the lead-free era, high-temperature and high-lead solders will gradually withdraw from the stage of history, and the fundamental problems of Au-based solder and nano-silver solder paste, such as high cost and poor reliability, cannot be solved, resulting in the failure of high-temperature lead-free interconnect materials. The blank area forms the interconnection manufacturing bottleneck and seriously hinders the development of the electronic packaging industry. [0003] At the same time, with the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/26B23K35/363B23K35/14
CPCB23K35/262B23K35/362
Inventor 郑振刘威王春青
Owner HARBIN INST OF TECH
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