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Temperature sensor and thermal flow rate measurement device

A technology of temperature sensor and measuring device, which is applied in the direction of measuring device, measuring device shell, liquid/fluid solid measurement, etc., and can solve problems such as fluids that cannot transfer heat

Active Publication Date: 2015-06-24
ENDRESS HAUSER FLOWTEC AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Once this power limit is reached, heat will not be transferred to the fluid even at greater speeds

Method used

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  • Temperature sensor and thermal flow rate measurement device
  • Temperature sensor and thermal flow rate measurement device

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Embodiment Construction

[0030] figure 1 A sensor of a thermal flow measuring device is shown, wherein the sensor is embodied as a thermal mass flow sensor 1 .

[0031] Traditionally, thermal flow measuring devices usually use two heatable resistance thermometers, which are implemented as identical as possible and are most often arranged in a pin-shaped metal sleeve, in a so-called stylus, or In a cylindrical metal sleeve, in thermal contact with the medium flowing through the measuring tube or through the pipe. For industrial applications, usually two resistance thermometers are installed in the measuring tube; however, resistance thermometers can also be installed directly in the pipe. One of the two resistance thermometers is a so-called active sensor element, which is heated by a heating unit. The heating unit provided is either an additional resistance heater or, in the case of a resistance thermometer as a resistance element, such as an RTD (Resistive Temperature Device) sensor, which is conve...

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Abstract

The invention relates to a temperature sensor having a housing (1), comprising a housing body and a housing chamber, in which housing chamber two temperature sensor elements are arranged at each end, which temperature sensor elements are in particular formed as thin-film resistance thermometers (4 or 5), wherein one of the temperature sensor elements can be heated, wherein at least one connection wire (23) leads from each temperature sensor element, which connection wire is connected to a printed circuit board (25), wherein the printed circuit board (25) is arranged in the housing chamber (1), wherein the printed circuit board (25) is positioned in said housing chamber by means of a latch connection (28), wherein a connection wire (23a) of a first temperature sensor element is routed in a strain-relieved manner in a first direction through the printed circuit board (25) and is connected to the latter, wherein the housing chamber has at least one first elastic body for routing the connection wire (23) and / or wherein the printed circuit board (25) is arranged in the housing chamber, wherein the printed circuit board (25) has a first number of material cut-outs, in particular holes, for the connection of connection wires and / or cables and a second number of material cut-outs, in particular holes, for reducing the thermal expansion of the printed circuit board, and a thermal flow rate measurement device.

Description

technical field [0001] The invention relates to a temperature sensor as defined in the preambles of claims 1, 5, 8 and 13, and to a thermal flow measuring device. Background technique [0002] Sensors for flow measuring devices are known which operate according to the thermal measurement principle. This measuring principle is based on the cooling of a resistance thermometer, hereinafter also referred to as thermal or active sensor element, from which heat is extracted by flowing through the measured medium. The extracted heat is supplied again by increasing the electrical heating current. In this way, a constant temperature difference is maintained between the heating and measuring sensor element, ie the active sensor element, and the reference temperature sensor, also referred to below as measuring or passive sensor element. To maintain this temperature difference, the greater the mass flow, the greater the energy requirement. Therefore, the measured heating current is p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01K1/08G01K1/14G01K7/18G01F1/684G01F1/69G01F1/692G01F1/698G01F15/02G01F15/14G01D11/24
CPCG01F1/684G01F1/69G01K7/18G01F1/692G01F15/14G01K1/08G01D11/245G01F1/696G01K7/16
Inventor 亚历山大·格林汉诺·舒尔特海斯托比亚斯·波尔
Owner ENDRESS HAUSER FLOWTEC AG
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