Automatic chip detection and packaging production line

Abstract

The invention discloses an automatic chip detection and packaging production line which comprises a chip transmission device, a suction pump and a rotary disc. The rotary disc moves circumferentially in the vertical axial direction of the suction pump, an annular groove is further formed in the portion, connected with the rotary disc, on the suction pump, and the portion, located on the annular groove, of the rotary disc is further connected with multiple suction devices. Each suction device is provided with a nozzle, the rotary disc is further connected with a power source, and the power source drives the rotary disc to drive the suction devices to rotate. An automatic feeding station, a structural size detection station, a current detection station, a capacitance detection station and a packaging station are sequentially connected to the periphery of the chip transmission device and all the stations and the transmission device are connected with a microcomputer control device. Automatic detection conducted on assembly line production after chips are manufactured and automatic packaging conducted after detection can be achieved, the accuracy degree of automatic detection of the production line and the quality of the chips are improved, secondary rework is avoided, and labor cost is saved.

Description

technical field [0001] The invention relates to the technical field of chip manufacturing, in particular to a chip automatic detection and packaging production line. Background technique [0002] The complete process of chip fabrication includes several links such as chip design, wafer fabrication, packaging fabrication, and cost testing, among which the wafer fabrication process is particularly complex. [0003] The first is chip design. According to the needs of the design, the "pattern" is generated, and the second is the production of wafers: the raw material wafers for the chips are selected, and then some pure silicon is made into silicon ingots, which become the materials for the quartz semiconductors of the integrated circuits. , slicing it is the wafer that is specifically required for chip fabrication. The thinner the wafer, the lower the production cost, but the higher the requirements for the process, followed by the wafer coating to improve its resistance to ox...

AI Technical Summary

Problems solved by technology

The existing chip detection does not sort the chips, but directly detects them. Due to the different orientations of the chips, it will cause errors in the infrared detection of the chips, and requires a second rework for detection.

And manual confirmation is required, the degree of automation is not high, and the labor cost is relatively high

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