Configuration and manufacturing process of LED module

Abstract

The invention discloses a configuration and a manufacturing process of an LED module. The manufacturing process is characterized by comprising the following steps: LED chips are fixed on the upper surface of a substrate by an insulating adhesive layer; two LED chips form a group and form an LED pair, electrode surfaces are upward; electrodes of the substrate are fixed on the upper surface of the substrate by the insulating adhesive layer; bonding wires are bonded to the electrodes of the substrate and the electrodes of the LED chip; a parallel connection part is arranged between every two adjacent LED pairs, and the bonding wire is led out from the electrodes of each LED chip in the LED pair and then is connected to the parallel connection part, so that the LED pairs become parallel connection units electrically connected in parallel; all parallel connection units are connected in series by the parallel connection part to form an LED string; finally, a phosphor layer is coated to cover the LED chips, the bonding wires and the insulating adhesive layer. According to the invention, all insulating layers and welding points of the substrate body are omitted; the thermal resistance is low; the uneven heat conduction caused by the welding process / configuration is further avoided; the LED chips are simple in fixing process and structure, and high in processing speed.

Description

Technical field [0001] The invention relates to the structure of an LED module and its manufacturing process. Background technique [0002] LED is becoming more and more popular in the field of lighting activities, so the demand for its products is also increasing, from concentrating lamps to the general lighting field including various flood lighting, a variety of LED modules have also emerged. Its purpose is to replace traditional light sources such as incandescent lamps and fluorescent lamps that have been widely used in lamp structures, so as to obtain even better lighting performance. [0003] Taking into account the characteristics of LED light sources, when a large area of ​​luminous body needs to be realized, a huge number of LED chip particles will inevitably be mounted on various forms of substrates, such as long strips of light, so that it has a uniform The light-emitting surface, on the one hand, can obtain a better heat dissipation effect, and on the other hand, it mu...

AI Technical Summary

Problems solved by technology

[0005] Aiming at the problems of poor heat dissipation of the PCB substrate in the existing LED module structure and production process, the contact and thermal resistance caused by LED chip welding, and the shortcomings of the existing LED module that are difficult to achieve high light efficiency, the present invention proposes an LED The structure of the module and its manufacturing process, its technical scheme is as follows:

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