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A packaging process suitable for small batch circuits

A packaging process, small batch technology, applied in the manufacturing of circuits, electrical components, semiconductor/solid-state devices, etc., can solve the problems of circuit or chip damage, poor impact resistance, strength reduction, etc., to improve the yield, anti-vibration shock The effect of good performance and quality improvement

Inactive Publication Date: 2017-07-14
ANHUI NORMAL UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These stresses will cause problems such as strength reduction, poor impact resistance, cracking, etc., and will cause damage to circuits or chips when working in high or low temperature environments

Method used

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  • A packaging process suitable for small batch circuits
  • A packaging process suitable for small batch circuits
  • A packaging process suitable for small batch circuits

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Embodiment Construction

[0027] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

[0028] image 3 It is the circuit to be packaged in the embodiment. When the circuit will be used in an environment of minus 55 degrees Celsius to 125 degrees Celsius, it needs to be resistant to vibration and shock. Packaging not only improves its confidentiality, but also increases its mechanical strength.

[0029] The packaging, aging and testing of the circuit are carried out at the same time, and the whole process is as follows:

[0030] (a) Pour the curing agent into the mold first, then put the circuit into the mold, and let the circuit immerse in the curing agent;

[0031] (b) Raise the mold together with the circuit from the room temperature S1°C to the specified high temperature S2°C;

[0032] (c) Make the circuit work at S2°C for t1 minutes, keep it for t2 minutes after power off, repeat the process of t1 and t2 many times, and th...

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Abstract

The invention discloses a packaging process suitable for small-batch circuits. Carry out packaging, aging and testing at the same time. The whole process is as follows: immerse the circuit in the curing agent; raise the mold together with the circuit from room temperature S1°C to the specified high temperature S2°C; make the circuit work at S2°C for t1 minutes, after the circuit is powered off Hold for t2 minutes, repeat t1, t2 process many times until the curing is completed; drop from S2°C to S3°C, make the circuit work at S3°C for t3 minutes, keep t4 minutes after power off, repeat t3, t4 many times. The beneficial effect of the present invention is: saving time. During the packaging process, the circuit or chip is repeatedly switched on and off to reduce the stress generated during the packaging process. After packaging, the mechanical strength is high, the reliability is high, and the yield rate is improved.

Description

technical field [0001] The invention relates to a circuit packaging process, in particular to a packaging process suitable for small-batch circuits. Background technique [0002] Packaging is necessary and critical for some circuits. Because some circuits need to be isolated from the outside world to prevent impurities in the air from corroding chips and leads and causing electrical performance degradation. At the same time, after some circuits are manufactured with integrated blocks, resistors, capacitors and other devices, they still need to be packaged to improve confidentiality. , Anti-vibration performance and anti-interference performance, so that it can be used in harsh environments, such as aviation, spaceflight, deep sea and battlefield. Packaging technology directly affects the performance of the circuit itself and the design and manufacture of PCB. [0003] According to the structural requirements of different products, it can be divided into encapsulation metho...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/50H01L21/56
Inventor 朱向冰朱家俊石殷巧张学峰桑坤杨宏运陈瑾
Owner ANHUI NORMAL UNIV
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