Butyl rubber modified SIS hot-melt pressure-sensitive adhesive
A hot-melt pressure-sensitive adhesive, butyl rubber technology, applied in the direction of adhesives, adhesive types, mineral oil hydrocarbon copolymer adhesives, etc., can solve the problems of residual monomer odor, poor low-temperature adhesion, waste of resources, etc. , to achieve the effect of wide bonding surface, rapid curing and large cohesive strength
Inactive Publication Date: 2015-05-27
青岛欧美亚橡胶工业有限公司
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Problems solved by technology
There are problems such as slow drying, poor adhesion at low temperature, and trace residual monomer odor during production
Solvent-based pressure-sensitive adhesives use organic solvents as the medium. After coating, the organic solvents are removed by drying to make pressure-sensitive adhesives. The organic solvents volatilize into the atmosphere to cause pollution, waste resources, and have high costs.
Method used
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Experimental program
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Effect test
Embodiment
[0014] The butyl rubber modified SIS hot-melt pressure-sensitive adhesive includes the following raw materials in parts by weight:
[0015] Styrene-isoprene-styrene block copolymer SIS 50 g, butyl rubber 50 g, C5 petroleum resin 50 g, terpene resin 50 g, naphthenic oil 30 g, dibutyldithioamino Zinc formate 3 g.
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Abstract
The invention discloses a butyl rubber modified SIS hot-melt pressure-sensitive adhesive, including the following raw materials by weight: 50 portions of styrene-isoprene-styrene block copolymer SIS, 50 portions of butyl rubber, 50 portions of C5 petroleum resin, 50 portions of terpene resin, 30 portions of naphthenic oil and 3 portions ofzinc dibutyl dithiocarbamate. The butyl rubber modified SIS hot-melt pressure-sensitive adhesive provided by the invention does not contain organic solvent, is non-toxic, harmless and pollution-free, and has the advantages of higher cohesive strength than a solvent-type pressure sensitive adhesive, fast curing, wide bonding plane, simpleness to manufacture, convenience to use, and a wide range of usage.
Description
[0001] technical field [0002] The invention relates to a hot-melt pressure-sensitive adhesive, in particular to a butyl rubber modified SIS hot-melt pressure-sensitive adhesive. [0003] Background technique [0004] Pressure-sensitive adhesives are adhesives that can be bonded instantaneously with a slight pressure. Usually, there are emulsion methods, solvent methods, and hot-melt methods. Emulsion-type pressure-sensitive adhesives are prepared by emulsion copolymerization of acrylate and modified monomers, and then applying the emulsion to the substrate, and drying to remove moisture. There are problems such as slow drying, poor low-temperature adhesion, and trace residual monomer odor during production. Solvent-based pressure-sensitive adhesives use organic solvents as the medium. After coating, the organic solvents are removed by drying to make pressure-sensitive adhesives. The organic solvents volatilize into the atmosphere to cause pollution, waste resources, and ...
Claims
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Patent Type & Authority Applications(China)
IPC IPC(8): C09J153/02C09J123/22C09J157/02C09J145/00C09J11/06
Inventor 张国盛
Owner 青岛欧美亚橡胶工业有限公司
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