A kind of sapphire printed circuit board led lamp and manufacturing method thereof

Abstract

The invention relates to a lamp, in particular to an LED lamp with high-efficiency heat dissipation function; it includes a housing, a light guide module and a light emitting module. It includes a first sapphire substrate and a reflective layer. The reflective layer light-emitting module includes a second sapphire substrate, a light-shielding layer, a metal conductive layer, a light-emitting module, and an anti-reflection layer. The beneficial effects of the present invention are reflected in the following: the present invention provides a The sapphire printed circuit board LED lamp with heat dissipation function, by setting the heat dissipation structure on the sapphire printed circuit board, directly carries out crystal bonding, wire bonding and dispensing on the sapphire printed circuit board, realizes the production of LED light-emitting modules, and eliminates the need for traditional printed circuit boards. The thermal resistance generated by the adhesive is used to improve heat dissipation efficiency, and a light-shielding layer is provided on the printed circuit board to ensure the luminous flux of the light-emitting module, prevent light leakage, and keep the light bright. The structure is simple and the cost is low.

Description

technical field [0001] The invention relates to a lamp, in particular to a sapphire printed circuit board LED lamp with strong heat dissipation and high brightness and a preparation method thereof. Background technique [0002] With the continuous development of society, due to the advantages of long working life, low energy consumption, small size, and stable light, LED lamps have been widely used in various lighting fields or electrical fields, such as street lights, searchlights, signal lights, car lights, airport lights, etc. Runway lights, bulb lights, etc. generally use LED light sources to replace traditional light bulbs. At present, LED lamps in the society generally fix the LED light source on the circuit board to form a light bar, and then fix the light bar on a conductive metal plate. The main heat dissipation method of this circuit board is to transfer the heat generated by the LED light source to the conductive plate. On the metal plate, the heat generated by t...

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Problems solved by technology

At present, LED lamps in the society generally fix the LED light source on the circuit board to form a light bar, and then fix the light bar on a conductive metal plate. The main heat dissipation method of this circuit board is to transfer the heat generated by the LED light source to the conductive plate. On the metal plate, the heat generated by the LED light strip is dissipated through the conductive metal plate. Due to the poor heat dissipation performance of the conductive metal plate itself, its heat dissipation capacity is limited. Under the premise of high heat generation of LED lamps, ideal heat dissipation cannot be achieved through the metal plate As a result, if the LED lamp works for a long time, it will generate huge heat. When the heat cannot be discharged quickly, it is easy to affect the life of the lamp due to overheating, and even burn the lamp. Moreover, this type of lamp has a complex structure, low cost, and poor practicability

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