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Organosilicone packaging glue for packaging LED lamp filament

A LED filament and silicone technology, applied in adhesives, adhesive additives, electrical components, etc., can solve problems such as high viscosity, difficult to degassing, inability to shape, and non-flowing surface, etc., so as to achieve no decrease in light transmittance and strong operability , good leveling effect

Inactive Publication Date: 2015-04-22
YANTAI DEBANG ADVANCED SILICON MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

LED filament packaging is a technological innovation. Its packaging process puts forward higher requirements for packaging glue. At present, there are glue systems in the market: the glue system has high viscosity, is not easy to degas, cannot be shaped, the surface is not level, and the light decay is serious after high temperature aging. Disadvantages such as colloid fracture, unable to meet customer requirements for operability and reliability

Method used

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  • Organosilicone packaging glue for packaging LED lamp filament
  • Organosilicone packaging glue for packaging LED lamp filament
  • Organosilicone packaging glue for packaging LED lamp filament

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] The preparation process of component A is as follows: Weigh 800g of vinyl silicone oil with a viscosity of 3000mpa.s and add it to a 2L vacuum kneader, weigh 200g of fumed silica (wacker N20), and add four times of equal mass to the vinyl silicone oil. After kneading and forming, raise the temperature to 140°C for 2 hours, vacuum for half an hour, the vacuum degree is -0.05Mpa~-0.07Mpa, then lower the temperature and cool down, when the temperature of the glue is cooled below 50°C, add 3g of catalyst platinum-vinylsiloxane (platinum content is 3000ppm), kneading at room temperature for half an hour to obtain the A component;

[0022] The preparation steps of component B are as follows: At room temperature, add 750g of vinyl silicone oil with a viscosity of 3000mpa.s, 50g of crosslinking agent, 20g of adhesive KH570, and 5g of inhibitor ethynyl cyclohexanol into the mixer in sequence, and fill it with nitrogen , mix and stir evenly to obtain the B component.

[0023] Wh...

Embodiment 2

[0025] The preparation process of component A is as follows: Weigh 800g of vinyl silicone oil with a viscosity of 500mpa. In silicone oil, after kneading and molding, heat up to 150°C for 2 hours, vacuum for half an hour, vacuum degree -0.05Mpa~-0.07Mpa, then cool down and cool down, when the temperature of the glue is cooled below 50°C, add 3g of catalyst platinum-vinyl silicon The oxane complex (with a platinum content of 5000ppm) was kneaded at room temperature for half an hour to obtain the A component;

[0026] The preparation steps of component B are as follows: at room temperature, add 750g of vinyl silicone oil with a viscosity of 500mpa.s, 150g of crosslinking agent, 20g of adhesive KH560, and 2g of inhibitor vinyl cyclohexanol into the mixer in sequence, and fill it with nitrogen , mix and stir evenly to obtain the B component.

[0027] When in use, mix the A component and B component uniformly in a weight ratio of 1:1, vacuum defoam for 20 minutes, test the viscosi...

Embodiment 3

[0029] The preparation process of component A is as follows: Weigh 850g of vinyl silicone oil with a viscosity of 15000mpa.s and add it to a 2L vacuum kneader, weigh 147g (wacker N20) fumed silica, add four times of equal mass to the vinyl silicone oil, After kneading and molding, raise the temperature to 145°C for 2 hours, vacuum for half an hour, the vacuum degree is -0.05Mpa~-0.07Mpa, then lower the temperature and cool down, when the temperature of the glue is cooled below 50°C, add 2g of catalyst platinum-vinylsiloxane (Platinum content is 5000ppm), kneading at room temperature for half an hour to obtain the A component;

[0030] The preparation steps of component B are as follows: at room temperature, add 950g of vinyl silicone oil with a viscosity of 15000mpa.s, 145g of crosslinking agent, 50g of adhesive KH570, and 3g of inhibitor vinyl cyclohexanol into the mixer in sequence, and fill it with nitrogen , mix and stir evenly to obtain the B component.

[0031] When in ...

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Abstract

The invention provides organosilicone packaging glue for packaging an LED lamp filament. The glue is prepared from a component A and a component B in a weight ratio of 1: 1, wherein the component A is prepared from the following raw materials in parts by weight: 80-90 parts of vinyl silicone oil, 10-20 parts of a thixotropic agent white carbon black and 0.1-0.3 part of a catalyst; the component B is prepared from the following raw materials in parts by weight: 75-95 parts of vinyl silicone oil, 5-15 parts of a catalyst, 2-5 parts of an adhesive and 0.1-0.3 part of an inhibitor. The LED lamp filament packaging silica gel provided by the invention is prepared from the components A and B. The component A provides the special thixotropic agent in the system, so that the glue has a good leveling property and strong operability while having good thixotropy. The light transmittance of cured glue is not decreased.

Description

technical field [0001] The invention relates to LED filament packaging silica gel, which belongs to the technical field of adhesives. Background technique [0002] LED filament, a brand-new LED packaging form, is also the most popular LED product nowadays. It can be used to make LED bulbs similar in shape to incandescent lamps, and can easily achieve 360-degree full-circle lighting. With the shape and light distribution curve similar to incandescent lamps, it is the most ideal light source to replace incandescent lamps in the true sense. Moreover, the production process of the bulb lamp is simple, and the material cost is low. With the improvement of the packaging process of the LED filament and the reduction of its cost, the cost of the LED filament bulb lamp will also drop rapidly. Now countries have successively issued regulations or plans to ban (ban) incandescent lamps. Once incandescent lamps below 60W are banned, the market demand for LED filament bulbs will show ex...

Claims

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Application Information

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IPC IPC(8): C09J183/07C09J11/04C09J11/06H01L33/56
Inventor 陈维徐庆锟王建斌陈田安
Owner YANTAI DEBANG ADVANCED SILICON MATERIALS
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