Light source module, fabrication method therefor, and backlight unit including the same

A light source module and backlight unit technology, which is applied in the direction of light source, electric light source, optical components, etc., can solve the problems of thinness limitation of backlight unit, degradation of LED package efficiency, etc., and achieve the effect of improving luminous efficiency

Active Publication Date: 2015-04-15
SEOUL SEMICONDUCTOR
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0008] In this case, since there is a height corresponding to the width of the LED package, the slimness of the backlight unit is limited
[0009] When reducing the width of the LED package to overcome such limitations, current spreading degrades the efficiency of the LED package

Method used

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  • Light source module, fabrication method therefor, and backlight unit including the same
  • Light source module, fabrication method therefor, and backlight unit including the same
  • Light source module, fabrication method therefor, and backlight unit including the same

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Embodiment Construction

[0044] Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. The following embodiments are provided by way of examples to fully convey the spirit of the present invention to those skilled in the art. Therefore, the present invention is not limited to the embodiments disclosed herein, but can also be implemented in different forms. In addition, the shapes of elements in the drawings may be exaggerated. Throughout the specification, the same reference signs indicate the same elements having the same or similar functions. Modifications of elements falling within the spirit and scope of the present invention do not include a restrictive meaning, but are provided to clearly express the spirit of the present invention, and can only be limited by the claims.

[0045] Hereinafter, the embodiments of the present invention will be specifically described with reference to the accompanying drawings, so that thos...

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Abstract

Disclosed are a light source module (100) having excellent luminous efficiency, a fabrication method therefor, and a slim backlight unit (BLU) including the same. The light source module (100) includes a light emitting diode (LED) chip (110) electrically connected to a substrate (140) through a lower surface thereof, a wavelength conversion layer (120) formed on the LED chip (110) and enclosing at least the light exit face of the LED chip (110), and a reflector (130) formed on a region of the LED chip excluding the light exit face.

Description

[0001] This application claims the priority and rights of Korean patent application No. 10-2013-0114736 filed on September 26, 2013 and Korean patent application No. 10-2014-0123053 filed on September 16, 2014, for all For the purpose of including these Korean patent applications by reference, as fully explained here. Technical field [0002] The present invention relates to a light source module, a manufacturing method thereof, and a backlight unit including the light source module, and more specifically, to a light source module with excellent luminous efficiency, a method of manufacturing the light source module, and a slim light source module including the light source module Backlight unit. Background technique [0003] Generally, the backlight unit is widely used to provide light to a display device such as a liquid crystal display (LCD) device or a surface lighting device. [0004] The backlight unit provided for the LCD device is mainly classified into a direct type and an ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21S8/00F21V7/00G02F1/13357F21Y101/02
CPCH01L33/46H01L33/505H01L33/486G02F1/133615H01L33/504H01L33/50H01L2933/0041H01L33/60G02B6/0073H01L2933/0058H01L2933/0033G02F1/133603G02F1/133605H01L2224/16225H01L2224/32225H01L2224/73204H01L33/56H01L2924/00
Inventor 南基范郑丞晧韩釉大李贞勋崔爀仲
Owner SEOUL SEMICONDUCTOR
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