A flexible e-fluidic packaging method that improves ductility
An encapsulation method and ductility technology, applied in decorative arts, microstructure devices, processing microstructure devices, etc., can solve the problem of difficult to ensure the deformation mode of the interconnect structure, affect the tensile properties of the interconnect structure, and the tensile ability of the interconnect structure. Binding and other problems to achieve the effect of improving work stability, good support, and avoiding electrical breakdown
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[0028] In order to make the objectives, technical solutions and advantages of the present invention clearer, the following further describes the present invention in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention, but not to limit the present invention. In addition, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.
[0029] figure 1 It is used to show the flow diagram of the fluid encapsulation process of the present invention. Refer to below figure 1 To explain the specific operation process in detail.
[0030] First, according to the structure of the microcavity, a mold with the corresponding structure can be designed and prepared, such as figure 1 As shown in the figure, the Ecoflex solution is configured, and th...
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