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Novel composite fiberboard material and novel manufacturing method and application thereof

A technology of composite fiber and board materials, applied in the field of composite fiber board materials and its preparation, can solve the problems of consumption of wood resources, limited sources of density board raw materials, excessive use of wood, etc., and achieve the goals of reducing consumption, improving strength and improving utilization efficiency Effect

Active Publication Date: 2015-03-25
深圳文业装饰设计工程有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Technical problem to be solved: too much wood is used in wood floor materials, or too much wood resources are consumed. As a substitute for wood, density boards have a wide range of applications, and the source of raw materials for density boards is relatively limited. The purpose of the present invention is to Some agricultural resource wastes are used as the composition of wood flooring materials, and while the agricultural waste residues are rationally utilized, composite fiberboard materials with good performance are also prepared

Method used

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  • Novel composite fiberboard material and novel manufacturing method and application thereof
  • Novel composite fiberboard material and novel manufacturing method and application thereof
  • Novel composite fiberboard material and novel manufacturing method and application thereof

Examples

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Effect test

Embodiment 1

[0021] (1) 5 kinds of raw materials of lignocellulose, bamboo chips, peanut shells, wheat bran and coconut shell fiber are pulverized respectively by weight, and pulverized to the particle size of each raw material mentioned above is 400 mesh; (2) grinding step (1) The crushed lignocellulose, bamboo chips, peanut shells, wheat bran, and coconut shell fibers are dried; (3) take 26Kg of lignocellulose, 16Kg of bamboo chips, 9Kg of peanut shells, 13Kg of wheat bran, and 8Kg of coconut shell fibers by weight, Mechanically mix evenly; (4) Set the temperature to 95°C, add 22Kg of urea-formaldehyde resin, 12Kg of bisphenol S-type epoxy resin, and 5Kg of 1,4-butenediol to the powder raw material in step (3), and stir until uniform (5) molding the fiberboard substrate material in step (4) under pressure in a mold with a pressure of 70MPa and a temperature of 85°C during pressurization.

Embodiment 2

[0023] (1) 5 kinds of raw materials of lignocellulose, bamboo chips, peanut shells, wheat bran, and coconut shell fiber are pulverized respectively by weight, and pulverized to the particle size of each raw material mentioned above is 300 mesh; (2) grinding step (1) The crushed lignocellulose, bamboo chips, peanut shells, wheat bran, and coconut shell fibers are dried; (3) take 40Kg of lignocellulose, 11Kg of bamboo chips, 5Kg of peanut shells, 7Kg of wheat bran, and 12Kg of coconut shell fibers by weight, Mechanically mix evenly; (4) Set the temperature to 75°C, add 12Kg of urea-formaldehyde resin, 6Kg of bisphenol S-type epoxy resin, and 9Kg of 1,4-butenediol to the powder raw material in step (3), and stir until uniform (5) molding the fiberboard substrate material in step (4) under pressure in a mould, the pressure being 90MPa, and the temperature during pressurization being 80°C.

Embodiment 3

[0025] (1) 5 kinds of raw materials of lignocellulose, bamboo chips, peanut shells, wheat bran, and coconut shell fiber are pulverized respectively by weight, and pulverized to the particle size of each raw material mentioned above is 300 mesh; (2) grinding step (1) The crushed lignocellulose, bamboo chips, peanut shells, wheat bran, and coconut shell fibers are dried; (3) take 35Kg of lignocellulose, 12Kg of bamboo chips, 8Kg of peanut shells, 12Kg of wheat bran, and 10Kg of coconut shell fibers by weight, Mechanically mix evenly; (4) Set the temperature to 75°C, add 14Kg of urea-formaldehyde resin, 8Kg of bisphenol S-type epoxy resin, and 6Kg of 1,4-butenediol to the powder raw material in step (3), and stir until uniform (5) molding the fiberboard substrate material in step (4) under pressure in a mold with a pressure of 86MPa and a temperature of 80°C during pressurization.

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Abstract

The invention belongs to the field of wooden floors and discloses a composite fiberboard material and the manufacturing method and application thereof. The composite fiberboard material comprises lignocellulose, bamboo scraps, peanut shells, wheat bran, coconut fiber, urea resin, bisphenol-S epoxy resin and 2-Butene-1,4-diol. The method for manufacturing the fiberboard material comprises the steps of (1) smashing raw materials, (2) drying the smashed raw materials obtained from the step (1), (3) mixing lignocellulose, bamboo scraps, peanut shells, wheat bran and coconut fiber mechanically evenly, (4) adding urea resin, bisphenol-S epoxy resin and 2-Butene-1,4-diol to the powder obtained from the step (3) and stirring the new mixture evenly, and (5) pressing the base fiberboard material obtained from the step (4) in a die to be formed.

Description

technical field [0001] The invention belongs to the field of wood flooring, and relates to a floor material and its preparation method and use, in particular to a composite fiberboard material and its preparation method and use. Background technique [0002] Density board, also known as fiberboard, is a man-made board made of woody materials such as trunk wood, branch wood, or other plant fibers by heat grinding, sizing, drying, paving, and hot pressing. The adhesive mainly uses urea-formaldehyde glue. It is soft and impact resistant, has high strength, uniform density after pressing, and is easy to reprocess. It has been widely used in many fields in our country, but its disadvantage is poor water resistance, which also limits its scope of use to a certain extent. . MDF is mainly used for laminate flooring, door panels, partition walls, furniture, etc. Density board is mainly used for surface treatment of mixed oil process in home decoration. Generally, medium density bo...

Claims

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Application Information

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IPC IPC(8): B27N3/04B27N1/00
CPCB27N1/00B27N3/04
Inventor 陈林美
Owner 深圳文业装饰设计工程有限公司
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