Printer with substrate protection structure

Abstract

The present invention provides a printer having a circuit board protection structure excellent in drop impact resistance and the like. The printer (1) comprises: an exterior casing (2); a mechanism frame (11), which is arranged inside the exterior casing (2); a pillar (14), which is erected between the exterior casing (2) and the mechanism frame (11). ); the circuit board (12), which is disposed separately from the exterior case (2) in the space between the exterior case (2) and the mechanism frame (11) on which the pillars (14) are erected. When the printer (1) falls or the like, the impact force is not easily transmitted from the exterior case to the circuit board. The impact force acting on the exterior case (2) is supported by the mechanism frame (11) side via the support (14), so the exterior case does not deform greatly and hit the surface of the circuit board or the like. It is possible to avoid deformation, damage, and cutting of the wiring pattern of the circuit board caused by dropping or the like.

Description

technical field [0001] The present invention relates to printers, scanners and the like. More specifically, it relates to a small portable printer and the like capable of protecting a built-in circuit board from damage and disconnection due to impacts such as falling. Background technique [0002] As a portable small electronic device, a portable small printer disclosed in Patent Document 1 is known. Small portable printers may be accidentally dropped by the operator on the ground, etc. Therefore, it is necessary to protect the built-in parts from the impact caused by the drop. In particular, a built-in circuit board on which a fine wiring pattern is formed is not resistant to impact, and disconnection, damage to the board, and the like are likely to occur. [0003] Patent Documents 2 and 3 propose a structure in which a substrate is fixed between upper and lower exterior cases in a state of sandwiching the outer peripheral portion of the substrate in electronic equipment ...

AI Technical Summary

Problems solved by technology

Therefore, sometimes the substrate cannot be arranged in a state sufficiently far from the exterior case inside the exterior case.

[0009] In this case, when a large external force such as a drop impact acts, the outer case is likely to bend and hit the surface of the substrate, resulting in cutting and damage of the fine wiring pattern.

In addition, when the exterior case is greatly deformed by the impact force, excessive stress and strain will be generated on the board placed in a close position, and the board may be damaged.

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