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A toughened and enhanced phenolic foam board

A phenolic foam board and reinforced technology, which is applied in the field of preparing phenolic foam board by mixing and foaming phenolic resin and lignin, can solve the problems of uneven physical and chemical properties, not being well utilized, difficult separation and extraction, etc. Energy consumption, energy consumption and cost reduction, cost reduction effect

Active Publication Date: 2016-07-06
锦州市好为尔保温材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to factors such as complex structure, heterogeneous physical and chemical properties, and difficulty in separation and extraction, lignin has not been well utilized in phenolic foams so far.

Method used

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  • A toughened and enhanced phenolic foam board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] Calculated in parts by weight, each gram is one part, and each component raw material is weighed:

[0033] 40 parts of foamable alkaline phenolic resin, 30 parts of calcium lignosulfonate, 12 parts of n-pentane, 20 parts of deionized water, 20 parts of sulfuric acid with pH=2, 3 parts of polyethylene glycol, 5 parts of polyurethane prepolymer share.

[0034] The raw material mixture obtained by stirring is poured into a mold, and foaming and curing are carried out in a constant temperature box with a temperature of 70° C. and a humidity of 50% for 2 hours. After obtaining the phenolic foam board, dry it at room temperature to obtain the required pure phenolic foam board.

[0035] The corresponding phenolic foam board was tested, and the results are shown in Table 1. Table 1 shows the test results of the phenolic foam board provided by the embodiment of the present invention.

Embodiment 2

[0037] Calculated in parts by weight, each gram is one part, and each component raw material is weighed:

[0038] 55 parts of foamable alkaline phenolic resin, 15 parts of sodium lignosulfonate, 12 parts of n-pentane, 20 parts of deionized water, 20 parts of sulfuric acid with pH=2, 3 parts of polyethylene glycol, 5 parts of polyurethane prepolymer share.

[0039] The raw material mixture obtained by stirring is poured into a mold, and foaming and curing are carried out in a constant temperature box with a temperature of 70° C. and a humidity of 50% for 2 hours. After obtaining the phenolic foam board, dry it at room temperature to obtain the required pure phenolic foam board.

[0040] The corresponding phenolic foam board was tested, and the results are shown in Table 1. Table 1 shows the test results of the phenolic foam board provided by the embodiment of the present invention.

Embodiment 3

[0042] Calculated in parts by weight, each gram is one part, and each component raw material is weighed:

[0043] 63 parts of foamable alkaline phenolic resin, 7 parts of sodium lignosulfonate, 12 parts of n-pentane, 20 parts of deionized water, 20 parts of sulfuric acid with pH=2, 3 parts of polyethylene glycol, 5 parts of polyurethane prepolymer share.

[0044] The raw material mixture obtained by stirring is poured into a mold, and foaming and curing are carried out in a constant temperature box with a temperature of 70° C. and a humidity of 50% for 2 hours. After obtaining the phenolic foam board, dry it at room temperature to obtain the required pure phenolic foam board.

[0045] The corresponding phenolic foam board was tested, and the results are shown in Table 1. Table 1 shows the test results of the phenolic foam board provided by the embodiment of the present invention.

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Abstract

The invention provides a toughened and reinforced phenolic foam plate which is prepared by mixing 50-70 parts by weight of alkaline phenolic resin, 7-30 parts by weight of lignin, 5-15 parts by weight of foaming agent, 15-30 parts by weight of water and 10-30 parts by weight of curing agent to form a phenolic resin foaming system, and carrying out heat foaming, curing and molding, and postcuring on the phenolic resin foaming system at one time to form the phenolic foam plate, wherein the heat foaming is carried out for 2-4h at the temperature of 40-80 DEG C and the humidity of 40-90%. According to the phenolic foam plate, the phenolic resin is modified during the foaming, the strength and toughness of the phenolic foam plate are greatly improved, and the cost of mass production of the phenolic foam plate is lowered.

Description

technical field [0001] The invention relates to the technical field of new building energy-saving materials, in particular to a method for preparing phenolic foam boards by mixing and foaming phenolic resin and lignin. Background technique [0002] During the development of my country's construction industry and industrial manufacturing industry in the past 30 years, insulation materials have gone through two stages: traditional inorganic materials and organic synthetic materials, and have made great contributions to my country's building energy conservation. However, the above-mentioned wall insulation materials have shortcomings. The production and processing of inorganic thermal insulation materials consumes a lot of energy, the thermal insulation effect is unstable for long-term use around the clock, and the construction process is complicated. Especially the material use process and post-use treatment are harmful to the environment and human body, so that they are banned...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L61/10C08L97/00C08L71/08C08L75/04C08J9/14
Inventor 陈枫卢焕青钱云翔
Owner 锦州市好为尔保温材料有限公司
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