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Substrate packaging method and structure

An encapsulation method and substrate technology, applied in the display field, can solve the problems such as difficulty in controlling the high glue width of the sealant 300 glue, difference between the glue height and glue width, etc., and achieve the effects of good encapsulation effect, simple process and simple structure.

Active Publication Date: 2015-02-18
TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the limitation of spacer particles, it is difficult to control the glue height and width of the frame glue 300 without spacer particles. There may be differences in glue height and glue width in this group of glasses and the previous group of glasses, or in the same group of glasses. difference

Method used

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  • Substrate packaging method and structure
  • Substrate packaging method and structure
  • Substrate packaging method and structure

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Embodiment Construction

[0033] In order to further illustrate the technical means adopted by the present invention and its effects, the following describes in detail in conjunction with preferred embodiments of the present invention and accompanying drawings.

[0034] see image 3 , the present invention provides a substrate packaging method, comprising the following steps:

[0035] Step 1, providing the substrate 20 and the package cover 10 .

[0036] The packaging cover plate 10 is a glass plate, and the substrate 20 is a TFT substrate.

[0037] Step 2, such as Figure 4 As shown, a circle of first sealant 31 is coated on the package cover 10 .

[0038] Please also see Figure 4 and Figure 6 , a display device 40 is provided on the substrate 20, a first gluing position 11 is provided on the package cover plate 10 corresponding to the periphery of the display device 40, and a first cutting line 13 is provided on the periphery of the first gluing position 11, A second gluing position 12 is pro...

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Abstract

The invention provides a substrate packaging method and structure. The substrate packaging method includes the steps of 1), providing a substrate and a packaging cover plate; 2), coating the packaging cover plate with a first box adhesive in a ring; 3), coating the packaging cover plate with a second box adhesive on the outer periphery of the first box adhesive in a ring; 4), allowing the packaging cover plate to be oppositely adhered to the substrate; 5), using an UV (ultraviolet) light source to irradiate to the first and second box adhesives to have the same cured; 6), performing cutting operation on the substrate and the packaging cover plate and cutting the portions, contacting with the second box adhesive, of substrate and the packaging cover plate so as to achieve packaging of the packaging cover plate and the base plate.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a substrate packaging method and packaging structure. Background technique [0002] In the field of display technology, flat panel display technologies (LCD, OLED) have gradually replaced CRT displays. Planar light source technology is a new type of light source, and its technology research and development is close to the market-oriented mass production level. In flat panel display and planar light source technology, the bonding of two pieces of flat glass is a very important technology, and its packaging effect will directly affect the performance of the device. [0003] Ultraviolet (UV) curing technology is the earliest and most commonly used technology for LCD / OLED packaging. It has the following characteristics: no solvent or a small amount of solvent is used, which reduces the pollution of the solvent to the environment; it consumes less energy and can be cured at low temp...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/52
CPCH01L33/005H01L33/486H01L33/52H01L2933/0033H01L2933/005H10K59/8722H10K71/40H10K59/8723H01L33/48G02F1/1339G02F1/1368H10K71/851H10K50/8426H10K59/12H10K71/00H10K50/8428H10K59/1201G02F1/13394
Inventor 刘亚伟刘至哲
Owner TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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