Ultra-wideband plane electromagnetic band-gap structure for suppressing high-speed circuit ground bounce noise

Abstract

The invention discloses a ultra-wideband plane electromagnetic band-gap structure for suppressing high-speed circuit ground bounce noise. The structure comprises a power supply layer, a high-speed microwave dielectric layer and a ground layer which are connected from top to bottom in sequence; the power supply layer comprises a plurality of basic cyclic units which are connected by a plurality of resonators through a connecting bridge. According to the technical scheme, the structure has the beneficial effects that the problem of voltage fluctuation caused by the transient current change in a high-speed hybrid circuit system can be effectively solved; the synchronous switching noise produced in the power distribution network can be obviously suppressed; the interference to a radio frequency / analog circuit in the hybrid circuit system can be reduced, and the resulting misoperation of a chip is avoided; a complementary split ring resonator is used to form the basic unit of the electromagnetic band-gap structure; therefore, the size of the unit structure can be reduced while the expected noise suppressing performance is reached; a cross connecting bridge is introduced, which can change the suppression depth, and thus the noise suppressing frequency band range can be expanded.

Description

technical field [0001] The invention relates to the technical field of electronic information, in particular to an ultra-wideband planar electromagnetic bandgap structure for suppressing ground bounce noise of high-speed circuits. Background technique [0002] In modern circuit systems, the rate of signal transmission is getting higher and higher, and in order to achieve low power consumption, the amplitude of the power supply is required to be lower and more stable, and at the same time various circuit modules such as high-speed digital circuits, RF / analog circuits, etc. They are all integrated together, the integration density of the system is getting higher and higher, and the mutual influence is becoming more and more obvious. As a power distribution network (PDN) that supplies power to the circuit system, almost all electronic components will be directly or indirectly distributed on it. As the most complex and bulky interconnection structure in the hybrid circuit syste...

AI Technical Summary

Problems solved by technology

However, as a periodic structure, EBG will destroy the continuity of the return current path and affect the transmission quality of the signal line when it is used as the reference plane of the signal line in the multilayer circuit package.

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