Silicon wafer hardness testing device

Abstract

The invention discloses a silicon wafer hardness testing device. According to the silicon wafer hardness testing device, a silicon wafer is fixed on a testing base, and the random movement of a pencil in two-dimensional directions is realized through arranging transverse tracks, a longitudinal track and a pencil testing module, so that a chip of any position on the silicon wafer is subjected to hardness test; the silicon wafer hardness testing device disclosed by the invention has only one point of contact, namely a pencil tip, with the tested silicon wafer, and preferably, the pressure on the silicon wafer applied by the pencil tip is adjusted through a weight or a height adjustment member, so that the testing pressure is even and uniform while the hardness of the silicon wafer is effectively and accurately measured, and the fracture to the surface of the silicon wafer is avoided.

Description

technical field [0001] The invention relates to the field of material hardness testing, in particular to a silicon wafer hardness testing device. Background technique [0002] With the rapid development of large-scale integrated circuits, the quality requirements for silicon wafers are getting higher and higher, and the mechanical strength of silicon materials directly affects the manufacturing yield of silicon wafers and integrated circuits. The high mechanical strength of the silicon material means that the fragmentation rate of the silicon wafer during the slicing, grinding and polishing process is low. cost. [0003] In recent years, the technology of fingerprint sensor products has developed rapidly. Various specifications of fingerprint sensors are used in mobile phones, computers, access control, sign-in machines and other fields, and the surface chips are made of silicon materials. Since the silicon material is a brittle material, the chip surface of the fingerprin...

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Problems solved by technology

[0005] However, the existing pencil hardness test method needs to manually test the predicted area on the silicon wafer, which is inconvenient and laborious, and the strength of manual operation is not easy to master; in addition, the conventional pencil hardness tester is usually tested by sliding on the surface of the film material. There are two wheels and three contact points on the surface to be tested. If it is used in the hardness test of silicon wafers, the three contact points will directly press against the silicon wafer, which will easily cause the silicon wafer to break

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