Light-emitting diode and encapsulating method thereof

Abstract

A light-emitting diode encapsulating method comprises the following steps that a substrate with a circuit structure is provided, at least one reflector cup is arranged on the substrate, at least one light-emitting diode chip is arranged on the substrate and in the reflector cup, and the light-emitting diode chip is electrically connected with the circuit structure; an encapsulating material is provided, the encapsulating material comprises a transparent layer and a fluorescent layer, and the hardness of the transparent layer is smaller than that of the fluorescent layer; the encapsulating material and the reflector cup are pressed together through a mould, part of the transparent layer is squeezed into the reflector cup and combined with the reflector cup, and the fluorescent layer is arranged outside the reflector cup and covers the transparent layer; the mould is removed, and the encapsulating material is solidified. By means of the light-emitting diode encapsulating method, the transparent layer can be easily combined with the reflector cup in the pressing process; meanwhile, the fluorescent layer is maintained to be of a layered structure with the uniform thickness, fluorescent powder is evenly distributed, and thus the light blending of a light-emitting diode is made to be even. The invention further provides the light-emitting diode.

Description

technical field [0001] The invention relates to a light-emitting diode packaging method and a light-emitting diode packaging structure manufactured by the method. Background technique [0002] Light-emitting diodes are energy-saving, environmentally friendly, and long-life solid-state light sources. Therefore, the research on light-emitting diode technology has been very active in the past ten years, and light-emitting diodes are gradually replacing traditional light sources such as fluorescent lamps and incandescent lamps. [0003] Before the light-emitting diode is applied to the above fields, the light-emitting diode chip needs to be packaged to protect the light-emitting diode chip, thereby obtaining higher luminous efficiency and longer service life. [0004] The usual LED packaging method injects the packaging body containing phosphor powder into the reflective cup to package the LED by pressing the mold. This method easily causes uneven distribution of phosphor powder...

AI Technical Summary

Problems solved by technology

[0004] The usual packaging method of light-emitting diodes uses the method of pressing the mold to inject the package containing phosphor powder into the reflective cup to package the light-emitting diodes. This method is likely to cause uneven distribution of phosphor powder in the phosphor layer.

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