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Epoxy resin composition containing composite flame retardant

A composite flame retardant and epoxy resin technology, applied in the direction of electrical components, circuits, electrical solid devices, etc., can solve the problems of lower moisture resistance, lower fluidity, lower fluidity and mold release, etc., and achieve solder resistance excellent effect

Inactive Publication Date: 2015-01-14
BEIJING SHOUKEHUA MICRO ELECTRONICS +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the above flame retardant technology, the method of adding inorganic phosphorus and organic phosphine compounds will reduce the moisture resistance and cause a decrease in reliability. The use of metal hydroxides will cause a decrease in fluidity and mold release, and increasing the proportion of fillers will also lead to fluidity. falling problem
[0005] In addition, when hydroxide is added as a flame retardant in semiconductor packaging materials, a large amount needs to be added to achieve V-0 level, resulting in a decrease in the fluidity of the material. Since hydroxide has a large amount of hydroxide, Will cause the material to stick to the mold

Method used

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  • Epoxy resin composition containing composite flame retardant
  • Epoxy resin composition containing composite flame retardant
  • Epoxy resin composition containing composite flame retardant

Examples

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Effect test

Embodiment 1

[0030] O-cresol novolac epoxy resin A1 ("N-665" manufactured by DIC Corporation of Japan) 15wt%

[0031] Phenol novolac resin B1 ("TD-2131" manufactured by DIC Corporation of Japan) 7wt%

[0032] 2-Methylimidazole C10.15wt%

[0033] 1,8-diazabicyclo(5,4,0)undecene-7C20.45wt%

[0034] Silica powder D (d50 is 25μm) 67wt%

[0035] Zinc molybdate E1 (d50 is 2μm) 2.4wt%

[0036] Zinc borate E2 (d50 is 2μm) 2.4wt%

[0037] Magnesium hydroxide E3 (d50 is 1μm) 1.6wt%

[0038] Aluminum hydroxide E4 (d50 is 1μm) 1.6wt%

[0039] Carnauba wax 0.4wt%

[0040] γ-glycidyl propyl ether trimethoxysilane 0.5wt%

[0041] Inorganic ion scavenger 0.2wt% (Japan TOAGOSEI Co., Ltd system IXE500 (Bi 2 o 3 ·3H 2 O))

[0042] Carbon black 0.5wt%

[0043] Liquid silicone oil 0.3wt%

[0044] Silicone rubber powder 0.5wt% (d50 is 1μm)

[0045]After weighing and mixing uniformly according to the above ratio, melt and knead evenly on a double-roller mixer preheated at a temperature of 70-100°C,...

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Abstract

The invention relates to a resin for semiconductor packaging, and particularly relates to an epoxy resin composition which contains a composite flame retardant and can improve soldering resistance of an epoxy resin composition molded material. The epoxy resin composition comprises the main components and contents: 3.5-15 wt% of epoxy resin, 3.1-10 wt% of phenolic resin, 65-87.5 wt% of a filler, and 2-10 wt% of the composite flame retardant (containing zinc molybdate, zinc borate, magnesium hydroxide and aluminum hydroxide). The epoxy resin composition containing the composite flame retardant is a semiconductor packaging material with excellent soldering resistance, and moreover, also has necessary liquidity, moldability, flame retardance and mechanical properties.

Description

technical field [0001] The invention relates to a resin for semiconductor encapsulation, in particular to an epoxy resin composition containing a composite flame retardant which can improve the solder resistance of epoxy resin composition molding materials. Background technique [0002] In recent years, due to environmental protection requirements, the solder used in the installation of semiconductor integrated circuits or discrete devices is being promoted to be "lead-free". Correspondingly, the infrared reflow temperature of soldering has become higher, which requires packaging materials to have higher solder resistance. ; At the same time, the bromine-antimony flame retardant system in the traditional epoxy resin composition for semiconductor packaging will no longer be used, and it will be replaced by an environmentally friendly flame retardant technology. [0003] In response to the above-mentioned needs, there are methods using red phosphorus (see JP Unexamined Publica...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08L61/06C08K13/02C08K3/24C08K3/38C08K3/22H01L23/29
Inventor 李刚王善学卢绪奎王冰冰李海亮
Owner BEIJING SHOUKEHUA MICRO ELECTRONICS
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