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Phenolphthalein polyaryletherketone modified epoxy structure adhesive film and preparation method thereof

A technology of phenolphthalein-based polyaryletherketone and epoxy structural adhesives, which is applied in the direction of epoxy resin adhesives, novolac epoxy resin adhesives, polyether adhesives, etc., can solve the problem of epoxy structural adhesives Low temperature and other problems, to achieve the effect of high shear strength, good heat resistance, high temperature resistance strength

Inactive Publication Date: 2014-12-10
INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The present invention aims to solve the problem of low temperature resistance of existing high-temperature curing epoxy structural adhesives, and provides a phenolphthalein-based polyaryletherketone modified epoxy structural adhesive film and a preparation method thereof

Method used

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Examples

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specific Embodiment approach 1

[0013] Specific embodiment 1: In this embodiment, a phenolphthalein-based polyarylether ketone modified epoxy structural adhesive film consists of 70-100 parts by mass of the main resin, 20-50 parts of the main toughening agent, 5-15 It is prepared from an auxiliary toughening agent of 10-20 parts, a curing agent of 10-20 parts and a coupling agent of 1-5 parts; the main resin is bisphenol A type epoxy resin, 3-6 functional epoxy resin and phenolic type One or several epoxy resins are mixed in any ratio.

specific Embodiment approach 2

[0014] Specific embodiment 2: The difference between this embodiment and specific embodiment 1 is that the phenolphthalein-based polyarylether ketone modified epoxy structural adhesive film consists of 75-95 parts by mass of main resin, 30-45 parts of main resin It is prepared by toughening agent, 8-15 parts of auxiliary toughening agent, 13-18 parts of curing agent and 2-4 parts of coupling agent. Others are the same as in the first embodiment.

specific Embodiment approach 3

[0015] Embodiment 3: The difference between this embodiment and Embodiment 1 is that the phenolphthalein-based polyaryletherketone modified epoxy structural adhesive film consists of 90 parts by mass of the main resin, 40 parts of the main toughening agent, Prepared from 12 parts of auxiliary toughening agent, 15 parts of curing agent and 3 parts of coupling agent. Others are the same as in the first embodiment.

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Abstract

The invention discloses a phenolphthalein polyaryletherketone modified epoxy structure adhesive film and a preparation method of the phenolphthalein polyaryletherketone modified epoxy structure adhesive film, and relates to an adhesive and a preparation method of the adhesive. The adhesive film and the preparation method of the adhesive film solve the problem that the temperature tolerance of an existing high-temperature cured epoxy structure adhesive is poor. The phenolphthalein polyaryletherketone modified epoxy structure adhesive film is prepared from a main resin, a main flexibilizer, an auxiliary flexibilizer, a curing agent and a coupling agent. The method comprises 1 weighing, 2 mixing the materials together, 3 preparing the adhesive; 4 preheating, calendaring and forming the film. The adhesive film has excellent heat resistance, damp-heat aging resistance, higher shearing strength, higher high temperature strength, and higher toughness. The method is used to prepare the phenolphthalein polyaryletherketone modified epoxy structure adhesive film, and is applied in the technical field of high polymer materials.

Description

technical field [0001] The invention relates to an adhesive and a preparation method thereof. Background technique [0002] High-temperature curing structural adhesive film is a kind of adhesive with a curing temperature above 175°C and an operating temperature above 121°C. It has the characteristics of high strength, high durability and long-term use under high temperature conditions. It is a high-temperature bearing for aviation and aerospace vehicles. It is an important structural adhesive material in the manufacture of structural parts. This type of adhesive is characterized by good toughness and high strength, but its heat resistance is affected by the heat resistance of the toughening material and dicyandiamide curing system. The glass transition temperature is about 145°C, and the long-term use temperature should not exceed 150°C. In recent years, with the rapid development of aerospace vehicles, the heat resistance requirements for epoxy structural adhesives have b...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/00C09J7/04C09J163/02C09J163/00C09J163/04C09J171/10
Inventor 冯浩曲春艳王德志毛勇王海民张杨李洪峰宿凯杨海冬
Owner INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
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