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Epoxy resin adhesive and preparation method thereof

A technology of epoxy resin and epoxy resin, applied in the direction of epoxy resin glue, adhesive, adhesive type, etc., can solve the problems of high toxicity, complex process and narrow proportion of mixing

Inactive Publication Date: 2014-11-19
HUIZHOU QIANGDA ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Existing epoxy resin adhesives have high toxicity, high volatility, narrow proportion, weak adhesion, poor toughness, and low flame retardant grade
[0004] The preparation method of existing epoxy resin glue has complex process, troublesome operation and low yield, so there is a need for improvement

Method used

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  • Epoxy resin adhesive and preparation method thereof
  • Epoxy resin adhesive and preparation method thereof
  • Epoxy resin adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0071] A kind of epoxy resin glue of the present embodiment comprises the raw material of following mass percent:

[0072]

[0073] The toughening agent in this embodiment is an epoxy toughening agent.

[0074] The flame retardant of this embodiment is an environment-friendly flame retardant.

[0075] The thixotropic agent in this embodiment is fumed silica.

[0076] The accelerator in this embodiment is an aliphatic amine accelerator.

[0077] The epoxy novolac resin of this embodiment is a heat-resistant epoxy novolac resin.

[0078] The bisphenol A epoxy resin in this embodiment is a bisphenol A liquid epoxy resin.

[0079] A kind of preparation method of epoxy resin glue of the present embodiment comprises the following processing steps:

[0080] Step A, weighing: according to the formula, weigh various raw materials and place them in different containers;

[0081] Step B, baking material: put silicon micropowder, toughening agent, flame retardant, carbon black, di...

Embodiment 2

[0091] A kind of epoxy resin glue of the present embodiment comprises the raw material of following mass percent:

[0092]

[0093]

[0094] The toughening agent in this embodiment is an epoxy toughening agent.

[0095] The flame retardant of this embodiment is an environment-friendly flame retardant.

[0096] The thixotropic agent in this embodiment is organic bentonite.

[0097] The accelerator in this embodiment is an acid anhydride accelerator.

[0098]The epoxy novolac resin of this embodiment is a heat-resistant epoxy novolac resin.

[0099] The bisphenol A epoxy resin in this embodiment is a bisphenol A liquid epoxy resin.

[0100] A kind of preparation method of epoxy resin glue of the present embodiment comprises the following processing steps:

[0101] Step A, weighing: according to the formula, weigh various raw materials and place them in different containers;

[0102] Step B. Baking material: Put silicon micropowder, toughening agent, flame retardant, c...

Embodiment 3

[0112] A kind of epoxy resin glue of the present embodiment comprises the raw material of following mass percent:

[0113]

[0114] The toughening agent in this embodiment is an epoxy toughening agent.

[0115] The flame retardant of this embodiment is an environment-friendly flame retardant.

[0116] The thixotropic agent of this embodiment is polyamide wax.

[0117] The accelerator in this embodiment is a polyetheramine catalyst.

[0118] The epoxy novolac resin of this embodiment is a heat-resistant epoxy novolac resin.

[0119] The bisphenol A epoxy resin in this embodiment is a bisphenol A liquid epoxy resin.

[0120] A kind of preparation method of epoxy resin glue of the present embodiment comprises the following processing steps:

[0121] Step A, weighing: according to the formula, weigh various raw materials and place them in different containers;

[0122] Step B, baking material: Put silicon micropowder, toughening agent, flame retardant, carbon black, dicyan...

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Abstract

The invention relates to an epoxy resin adhesive. The epoxy resin adhesive comprises the following raw materials in percentage by mass: 25-66% of silicon micropowder, 10-45% of a toughening agent, 10-30% of bisphenol A type epoxy resin, 1.5-3.5% of a flame retardant, 0.05-0.5% of carbon black, 1.5-4% of phenolic aldehyde epoxy resin, 1.4-4% of dicyandiamide, 2.5-5.6% of a thixotropic agent and 1.5-3.6% of an accelerant. The epoxy resin adhesive has the advantages of low toxicity, volatility effect, wide blending ratio, strong bonding force, good toughness and high flame retardant level which can reach V-0. The preparation method of the epoxy resin adhesive comprises the following processing steps of weighting, roasting, dispersing, mixing, pressing, mixing, pressing, vacuumizing, sampling, inspecting and packaging. The preparation method has the advantages of simple process, convenience in operation and high yield and suitable for large-scale popularization and application.

Description

technical field [0001] The invention relates to the technical field of chemical products, in particular to an epoxy resin glue and a preparation method thereof. Background technique [0002] Epoxy resin adhesive generally refers to an adhesive made mainly of epoxy resin. [0003] Existing epoxy resin adhesives have high toxicity, high volatility, narrow matching ratio, weak cohesive force, poor toughness, and low flame-retardant grade. [0004] The existing preparation method of epoxy resin glue has complicated process, cumbersome operation and low yield, so there is a need for improvement. Contents of the invention [0005] The present invention provides an epoxy resin glue and a preparation method thereof in order to overcome the above-mentioned defects. The epoxy resin glue has low toxicity, low volatility, wide matching ratio, strong cohesive force, good toughness, and a flame-retardant grade of V -0, high flame retardant grade; the preparation method of the epoxy re...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J11/04
Inventor 黄大国
Owner HUIZHOU QIANGDA ELECTRONICS
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