A kind of preparation method of ultrafine copper sheet

Abstract

The invention discloses a method for manufacturing a superfine copper sheet. The method includes the steps that spherical copper powder which is 0.5-1 micrometer in average grain diameter is used as raw materials, a continuously-discharging type grinding miller is selected for grinding the copper powder, and grinding operation is carried out three times, wherein slurry is mainly dispersed in advance through grinding operation for the first time, the stirring rotating speed of the grinding miller is controlled to range from 200 ppm to 600 ppm, and the slurry inlet-and-outlet flow is controlled to range from 1 L / min to 5 L / min; the copper sheet is gradually formed through grinding operation for the second time, the rotating speed of a stirrer is controlled to range from 600 ppm to 1200 ppm, and the slurry inlet-and-outlet flow is controlled to range from 1 L / min to 5 L / min; the copper sheet is completely formed through grinding operation for the third time, the rotating speed of the stirrer is controlled to range from 600 ppm to 1200 ppm, and the slurry inlet-and-outlet flow is controlled to range from 1 L / min to 5 L / min. By means of the method, the grinding efficiency of the copper sheet can be improved, and the aim of stringently managing and controlling the product quality can be achieved by finely controlling operating parameters such as the stirring rotating speed of the grinding miller and the slurry grinding miller inlet-and-outlet flow.

Description

technical field [0001] The invention relates to the technical field of preparation of ultra-fine copper sheets, and specifically introduces a method for preparing ultra-fine copper sheets suitable for the fields of conductive coatings, conductive adhesives, and electric-grade materials, using spherical copper powder with a particle size of 0.5-1um (micron) as a raw material. method, the diameter of the copper sheet can be controlled within 5um (it can be called ultra-fine copper sheet). Background technique [0002] As a conductive filler, ultrafine copper powder is widely used in conductive coatings, conductive adhesives, electrode materials, etc. Compared with spherical copper powder, flake copper powder has great advantages in increasing the contact surface of powder and improving the smoothness of powder surface. Therefore, when flake copper powder is selected as the conductive filler, it is more conducive to the conduction of charges and the improvement of conductivity...

AI Technical Summary

Problems solved by technology

[0003] At present, there are many reports on the preparation of copper sheets by ball milling, but this kind of ball milling has the following disadvantages: (1) low production efficiency, long single production cycle, and low output, which cannot realize industrial production in the true sense; (2) Limited by the structure, performance and ball size of the ball mill, it is still impossible to realize the large-scale production of ultra-fine copper sheets (diameter<5um); (3) There is a single means of controlling the parameters of copper sheets, and often only by changing the grinding Rotational speed and grinding time achieve the purpose of controlling the diameter of the sheet, but it is impossible to achieve fine control of various parameters of the copper sheet, such as sheet diameter, specific surface area, tap density, dispersion, etc.

[0004] In addition, there are often some super large particles or uneven particles in the raw copper powder, which will lead to uneven size of the copper sheet during tableting, and it is difficult to effectively control the parameters of the copper sheet; During the whole processing process, it is easily oxidized at high temperature and seriously affects its performance and use effect

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