A magnetron bush sputtering machine

Abstract

The invention discloses a novel magnetron bearing bush sputtering machine, which relates to the technical field of sputtering devices, and comprises a sputtering housing, in which a sputtering chamber is provided, and the sputtering chamber is provided with a sputtering target support frame and a bearing bush support The bottom of the sputtering shell is provided with a base, the sputtering target support frame and the bearing bush support frame are arranged on the bottom base of the sputtering shell, the sputtering target support frame is provided with a sputtering target frame shaft, and the bottom of the sputtering target frame shaft is A rotating ring is provided, and the rotating ring is connected to the edge of the sputtering target support frame on one side of the sputtering target frame shaft through a connecting rod. There is a motor at the bottom of the sputtering shell, and the rotating ring is connected to the output shaft of the motor. The sputtering target frame The sputtering target support frame on both sides of the shaft is equipped with a sputtering target, and the two sides of the sputtering target are provided with grooves. The bottom surface of the front groove is a nickel target, and the bottom surface of the back groove is an alloy target. It solves the constraints of steps such as cooling down and replacing the target in the past, which increases the work output and improves the efficiency.

Description

technical field [0001] The invention relates to a sputtering device, in particular to a magnetron bush sputtering machine. Background technique [0002] Magnetron sputtering is to form an orthogonal electromagnetic field on the surface of the cathode target. The electron density in this area is high, thereby increasing the ion density, so that the sputtering rate is increased (an order of magnitude), and the sputtering speed can reach 0.1-1um / min. The focus is better than evaporation, and it is one of the most practical coating technologies at present. In magnetron sputtering, the usual method of processing standard bearing bushes is: 1. First manufacture the steel back, 2. Sinter or pour a copper-based alloy layer on the steel back , 3. Send the bearing bush substrate into the sputtering equipment for layered sputtering nickel grid layer and friction-reducing alloy layer. This method is safe and environmentally friendly, but the disadvantage is that two layers (nickel grid ...

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Problems solved by technology

[0002] Magnetron sputtering is to form an orthogonal electromagnetic field on the surface of the cathode target. The electron density in this area is high, thereby increasing the ion density, so that the sputtering rate is increased (an order of magnitude), and the sputtering speed can reach 0.1-1um / min. The focus is better than evaporation, and it is one of the most practical coating technologies at present. In magnetron sputtering, the usual method of processing standard bearing bushes is: 1. First manufacture the steel back, 2. Sinter or pour a copper-based alloy layer on the steel back , 3. Send the bearing bush substrate into the sputtering equipment for layered sputtering nickel grid layer and friction-reducing alloy layer. This method is safe and environmentally friendly, but the disadvantage is that two layers (nickel grid layer and friction-reducing alloy layer ), limited by the current sputtering equipment, so after sputtering the nickel grid layer, it is necessary to cool down and replace the nickel target with an alloy target. This sputtering method is restricted by steps such as cooling down and replacing the target material. very low

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