A high-voltage fast soft recovery diode and its preparation method

A soft recovery and diode technology, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problem that reverse recovery softness and reliability cannot be guaranteed, diode high-temperature leakage current static power consumption increases, and it is difficult to obtain comprehensive Characteristics and other issues, to achieve the effect of improving the reverse recovery softness factor, increasing the terminal breakdown voltage, and reducing the surface electric field

Active Publication Date: 2017-04-19
RUNAU ELECTRONICS YANGZHOU MFG
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the development process of high-voltage FSRD chips, there are two main technical problems: one is the optimization of comprehensive characteristics
Due to the constraints of device structure parameters, there is a contradictory relationship between high blocking voltage, low on-state voltage drop and fast soft recovery characteristics, and it is difficult to obtain excellent comprehensive characteristics
Usually high withstand voltage and low on-state voltage drop can be achieved, but fast soft recovery cannot be guaranteed
For this reason, a uniform minority carrier lifetime control technology is adopted to improve the reverse recovery characteristics of the high-voltage FSRD, but this will lead to a significant increase in the high-temperature leakage current of the diode and its static power consumption
The second is the terminal problem
The active region uses p + no - nn + structure, at the anode p + district and n - area, cathode n + district and n - A low-concentration, thicker p-buffer layer and n-buffer layer are added between the regions; the terminal region adopts a conventional field-limiting ring structure, and the cathode side on the back is n + In this area, the electron injection efficiency is 1 to meet the requirements of high withstand voltage, low on-state voltage drop and fast recovery characteristics, but the reverse recovery softness and reliability cannot be guaranteed

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  • A high-voltage fast soft recovery diode and its preparation method
  • A high-voltage fast soft recovery diode and its preparation method
  • A high-voltage fast soft recovery diode and its preparation method

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Embodiment Construction

[0041] The principles and features of the present invention are described below in conjunction with the accompanying drawings, and the examples given are only used to explain the present invention, and are not intended to limit the scope of the present invention.

[0042] Such as figure 2 As shown, it is a high-voltage fast soft recovery diode according to the present invention, including a shared n - active region 1 and termination region 2 of substrate layer 10;

[0043] The active region 1 of n - The p buffer layer 11, p buffer layer 11, p + Anode layer 12 and anode aluminum electrode 13; with n - The lower surface of the substrate layer 10 is an active n-buffer layer 14 and a cathode aluminum electrode 20 arranged downwards in sequence, and also includes an active p buffer layer 14 and the cathode aluminum electrode 20 arranged between the active n + adjustment area 15 and two n of equal width + Cathode region 16, the active p + The adjustment area 15 is set at two ...

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Abstract

The invention relates to a high-voltage rapid-soft-recovery diode. The high-voltage rapid-soft-recovery diode comprises an active area and a terminal area. A p buffering layer, a p+ anode layer and an anode aluminum electrode are upwards arranged on the upper surface of an n-substrate layer of the active area in sequence. An active n buffering layer and a cathode aluminum electrode layer are downwards arranged in sequence with the lower surface of the n-substrate layer as the base. The high-voltage rapid-soft-recovery diode further comprises an active p+ adjusting area and two n+ cathode areas, wherein the active p+ adjusting area and the two n+ cathode areas are arranged between the active n buffering layer and the cathode aluminum electrode layer, two n+ cathode areas are equal in width, and the active p+ adjusting area is arranged between the two n+ cathode areas. According to the high-voltage rapid-soft-recovery diode, trenches are adopted by the upper surface of the terminal portion, a high-concentration area on the surface of a p-type field limiting ring is eliminated selectively, bending of a pn junction can be relieved, the surface electrical field can be reduced, the terminal breakdown voltage can be increased easily, and the terminal size is small; current concentration at the junction position of the active area and the terminal area in a breakover period can be easily relieved through the p+ adjusting area located on the lower surface of the terminal portion, and reverse recovery softness factors can be increased easily.

Description

technical field [0001] The invention relates to a structure of a high-voltage fast soft recovery diode and a preparation method thereof. Background technique [0002] A high-voltage fast soft recovery diode (FSRD) is a diode used for freewheeling in a circuit. It is usually a square chip structure and is packaged into a module with a high-voltage insulated gate bipolar transistor (IGBT). In practical applications, FSRD is required to have high withstand voltage, low loss, fast soft recovery characteristics and high reliability. [0003] In the development process of the high-voltage FSRD chip, there are two main technical problems: one is the optimization of the comprehensive characteristics. Due to the constraints of device structure parameters, there is a contradictory relationship between high blocking voltage, low on-state voltage drop and fast soft recovery characteristics, and it is difficult to obtain excellent comprehensive characteristics. Usually high withstand v...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L29/861H01L29/06H01L21/329
CPCH01L29/0615H01L29/0684H01L29/6609H01L29/8613
Inventor 王彩琳张磊李丹杨晶高占成徐爱民
Owner RUNAU ELECTRONICS YANGZHOU MFG
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