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Microwave passive circuit electromagnetic heat integral analysis method based on time domain spectrum element method

A technology of time-domain spectral element method and passive circuit, which is applied in the field of electromagnetic-thermal integrated analysis, can solve the problems of huge calculation amount, inability to simulate, waste of time, etc., and achieve flexible modeling, convenient subdivision, and reduced calculation amount Effect

Active Publication Date: 2014-09-17
NANJING UNIV OF SCI & TECH
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Problems solved by technology

However, due to the Yee grid characteristics of FDTD, it cannot simulate the model with complex structure.
When FEM is applied to the time domain, each time step involves the solution of linear equations, the amount of calculation is very large, and it is a waste of time

Method used

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  • Microwave passive circuit electromagnetic heat integral analysis method based on time domain spectrum element method
  • Microwave passive circuit electromagnetic heat integral analysis method based on time domain spectrum element method
  • Microwave passive circuit electromagnetic heat integral analysis method based on time domain spectrum element method

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Embodiment Construction

[0013] The present invention will be described in further detail below in conjunction with the accompanying drawings.

[0014] 1. Simple derivation of conduction equation

[0015] At the point (x, y, z) in the heat medium, the heat transfer at time t satisfies the partial differential equation of heat conduction, that is, the heat conduction equation (HTE), and the form of the equation is:

[0016] ρ m c m ∂ T ( x , y , z ) ∂ t = k t ▿ 2 T ( x , y , z ) - V ...

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Abstract

The invention discloses a microwave passive circuit electromagnetic heat integral analysis method based on a spectrum element method. According to the method, firstly, a time domain spectrum element method is adopted for solving maxwell's equations, the instantaneous electric field and magnetic field distribution of a circuit under the effect of high-power pulses is worked out, and the electromagnetic loss at the current moment is obtained. If all of the electromagnetic loss inside a mold is converted into heat energy, the obtained heat energy is substituted into a heat conduction equation, and the temperature distribution conditions of each point at the current moment are obtained. Electricity characteristic parameters of materials at a next moment are obtained by utilizing a relational expression of dielectric parameters along with the temperature change, an electromagnetic field equation is calculated again, and the electromagnetic loss is obtained. The operation is repeatedly cycled in such a way until the preset heating time is completed. Through the electromagnetic heat integral analysis, the distribution condition of the temperature inside the mold along the time change when a filter receives the effect of different pulses can be clearly obtained, the modeling is flexible, the subdivision is convenient, formed matrixes have good sparsity, and the solving efficiency is higher.

Description

technical field [0001] The invention belongs to the electromagnetic-thermal integrated analysis of microwave passive devices, in particular to the numerical analysis method for SIW filter design. Background technique [0002] Since the 1970s, due to the rapid development of computer technology, computational electromagnetics has developed rapidly. Compared with analytical methods, numerical methods can solve a large class of problems with huge calculations and complex structures, but it is difficult or impossible for analytical methods to obtain accurate results. For microwave passive circuits, such as filters and microstrip lines, the thermal effect action process can be separately considered as an electromagnetic solution process and a thermal model solution process. That is, corresponding to the solution of Maxwell's electric field wave equation and heat conduction equation respectively. To study the microwave thermal model is to choose the appropriate numerical analysi...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F17/50
Inventor 陈如山丁大志樊振宏盛亦军陈桂莲
Owner NANJING UNIV OF SCI & TECH
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