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Hollow microsphere/Ni-Fe-P/Cu composite coating and preparation method thereof

A technology of hollow microspheres and composite coatings, applied in coatings, liquid chemical plating, metal material coating processes, etc., can solve problems such as easy sedimentation and high density, and achieve difficult deposition, high conductivity, and wide frequency range Effect

Active Publication Date: 2014-09-03
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Conductive coatings are an important branch of electromagnetic shielding materials. Silver powder, copper powder, nickel powder, and carbon powder are the most widely used conductive fillers in conductive coatings, but they are dense and easy to settle

Method used

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  • Hollow microsphere/Ni-Fe-P/Cu composite coating and preparation method thereof
  • Hollow microsphere/Ni-Fe-P/Cu composite coating and preparation method thereof
  • Hollow microsphere/Ni-Fe-P/Cu composite coating and preparation method thereof

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specific Embodiment approach 1

[0026] Specific embodiment one: a kind of hollow microsphere / Ni-Fe-P / Cu composite coating of this embodiment is composed of from inside to outside: matrix hollow microsphere, amorphous Ni-Fe-P soft magnetic coating and nano-Cu Conductive plating.

[0027] The hollow microsphere composite coating of the present embodiment forms three interfaces from the inside to the outside: the semi-vacuum space in the cavity and the hollow microsphere wall, the hollow microsphere wall and the Ni-Fe-P coating and the Ni-Fe-P plating and Cu plating. The hollow microsphere / Ni-Fe-P / Cu composite coating has the characteristics of the two single coatings, and at the same time increases the interface, which is beneficial to broadband shielding and improves the electromagnetic shielding performance of the material.

specific Embodiment approach 2

[0028] Specific embodiment two: the preparation method of a kind of hollow microsphere / Ni-Fe-P / Cu composite coating of the present embodiment is to carry out according to the following steps:

[0029] 1. Cleaning: with NaOH and Na 2 CO 3 Prepare alkaline cleaning solution for raw materials, the concentration of NaOH in the prepared alkaline cleaning solution is 10-30g / L, NaOH 2 CO 3 The concentration is 15-40g / L, the hollow microspheres with a particle size of 1-100μm are added to the above alkaline cleaning solution, and the temperature is 20-40°C for magnetic stirring or mechanical stirring for 20-50min, and the Floating glass beads on the upper layer, and then wash with deionized water or distilled water for 1 to 3 times until the solution is neutral, and finally dry in a drying oven at a temperature of 40 to 70°C for 30 to 70 minutes to obtain hollow microspheres with a clean and rough surface. beads;

[0030] 2. Sensitization: use concentrated HCl with a mass concentr...

specific Embodiment approach 3

[0040] Specific embodiment three: the difference between this embodiment and specific embodiment two is: the concentration of NaOH in the alkaline cleaning solution after preparing in the step 1 is 20g / L, NaOH 2 CO 3 The concentration is 30g / L. Others are the same as in the second embodiment.

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Abstract

The invention provides a hollow microsphere / Ni-Fe-P / Cu composite coating and a preparation method thereof, relating to a hollow microsphere composite coating and a preparation method thereof. The hollow microsphere / Ni-Fe-P / Cu composite coating comprises a matrix hollow microsphere, an amorphous Ni-Fe-P soft magnetic coating and a nano Cu conductive coating from inside to outside. The method comprises the following steps: I. washing; II sensitizing with SnCl2; III. activating with PdCl2; IV. chemical plating of Ni-Fe-P; V. chemical plating of Cu. The hollow microsphere composite coating has light weight, high permeability, high conductivity and multiple interfaces, and thus the hollow microsphere composite coating can be used for preparing electromagnetic shielding coatings with good shielding property, wide frequency range and light weight. Besides, the hollow microsphere composite coating can be also applied in the field of wave absorption and is applied in the field of hollow microsphere surface chemical plating.

Description

technical field [0001] The invention relates to a hollow microsphere composite coating and a preparation method thereof. Background technique [0002] Electromagnetic waves are harmful to human health, cause electromagnetic interference to electronic systems of precision electronic instruments, avionics products, navigation equipment, scientific measurement, medical care and important projects, and are likely to cause leakage of confidential information in military, political and economic aspects. Electromagnetic waves take corresponding shielding and protection measures. [0003] Conductive coatings are an important branch of electromagnetic shielding materials. Silver powder, copper powder, nickel powder, and carbon powder are the most widely used conductive fillers in conductive coatings, but they are dense and easy to settle. Therefore, light and cheap hollow microspheres are often used as the core material, and the surface is covered with a conductive film layer with c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/36C23C18/40B22F1/02B82Y40/00B82Y30/00
Inventor 张强张孟孟武高辉
Owner HARBIN INST OF TECH
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