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Washing device used for chemical mechanical polishing equipment

A cleaning device and chemical-mechanical technology, used in grinding/polishing equipment, grinding/polishing safety devices, surface-polishing machine tools, etc., to achieve the effects of reducing the chance of wafer scratches, simple device structure, and convenient use

Inactive Publication Date: 2014-06-25
SHANGHAI HUAHONG GRACE SEMICON MFG CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

And existing wafer cleaning device 11 can only clean the wafer that moves to directly above it

Method used

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  • Washing device used for chemical mechanical polishing equipment
  • Washing device used for chemical mechanical polishing equipment
  • Washing device used for chemical mechanical polishing equipment

Examples

Experimental program
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Embodiment Construction

[0023] The present invention will be further elaborated below by describing a preferred specific embodiment in detail in conjunction with the accompanying drawings.

[0024] A kind of chemical mechanical polishing equipment used in semiconductor production, including a plurality of polishing tables 10, a plurality of polishing heads are arranged above the polishing table 10, a top cover is arranged above the polishing heads, and a wafer is also arranged at the adjacent position of the polishing table 10 Carrying mechanism 12, during wafer polishing production, a polishing pad is set on each polishing table 10, and abrasive liquid is added on the polishing pad, and the polishing head holds the wafer to be polished facing down and presses it on the polishing table 10 for polishing. Polishing is carried out on the pad, and each polishing head is movable.

[0025] See attached Figure 4 As shown, a cleaning device for chemical mechanical polishing equipment of the present inventi...

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PUM

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Abstract

The invention discloses a washing device used for chemical mechanical polishing equipment. The washing device is characterized by including a shell and multiple nozzles arranged at intervals and in a row, the nozzles include straight nozzles used for spraying water to wafers and bent straight nozzles used for spraying water to the inner wall of the top cover of the chemical mechanical polishing equipment, the nozzles are connected with an outside water incoming pipe through a water pipe, the straight nozzles are vertically arranged on the shell, each bent nozzle is bent to be an obtuse angle, water outlets of the bent nozzles are different in direction, and the washing device is arranged at a position adjacent to each polishing platform of the chemical mechanical polishing equipment. By the washing device, the wafers can be washed while the inner wall of the top cover of the chemical mechanical polishing equipment is washed to enable the inner wall to constantly maintain humid, so that grinding liquid sprayed on the inner wall of the top cover in the process of polishing cannot be dried and crystallize, probability that grinding liquid crystals drop down and scratch the wafers in the process of polishing is lowered, and finished product rate of polishing production is increased. The washing device is simple in structure, convenient to use and low in cost.

Description

technical field [0001] The invention relates to a cleaning device, in particular to a cleaning device for chemical mechanical polishing equipment. Background technique [0002] See attached figure 1 As shown, the chemical mechanical polishing equipment used in semiconductor production usually includes a plurality of polishing tables 10, a plurality of polishing heads are arranged above the polishing table 10, a top cover is arranged above the polishing heads, and the adjacent positions of each polishing table 10 A wafer cleaning device 11 is provided, and a wafer carrying mechanism 12 is also provided at the adjacent position of the polishing table 10, referring to the appended figure 2 And attached image 3 As shown, the wafer cleaning device 11 includes a housing 1 and a plurality of straight nozzles 21 arranged vertically at intervals on the housing 1, the water outlets of the straight nozzles 21 are directed upwards, image 3 The arrow in represents the spraying dire...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B29/02B24B55/06
CPCB08B3/02
Inventor 顾军邱麟刘波
Owner SHANGHAI HUAHONG GRACE SEMICON MFG CORP
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