Automatic test system for digital integrated circuit

Abstract

The invention discloses an automatic test system for a digital integrated circuit. The automatic test system is composed of a tested chip, a test interface board, an integration module, a test module, a control module, a display module and an upper computer. The control module is connected with the upper computer. The test module is connected with the control module. A base pin of the tested chip is connected with the test interface board which is connected with the test module. The integration module is connected with the test module and the upper computer. The display module is connected with the control module and displays a waveform after final comparison by the aid of upper computer software, so that the automatic test for functions and performance of the chip is completed. The automatic test system is low in cost, easy to implement under laboratory conditions, easy and convenient to operate, high in development rate and capable of meeting the test requirements of small-batch products. According to the system, through an automatic test, the problem that operation is complex due to the fact that the number of test items is large in a manual test is solved, the test efficiency is enhanced, a misjudgment caused by artificial factors in the manual test is avoided, and therefore test quality is improved.

Description

technical field [0001] The invention belongs to the technical field of integrated circuit testing, and relates to an automatic testing system, in particular to an online testing system for digital integrated circuits. Background technique [0002] With the rapid development of integrated circuit technology, testing has become an important link in the development of integrated circuits. For digital integrated circuit testing, three testing methods are mainly used at present: [0003] In the first method, testers design and manufacture special test circuit boards according to the functional characteristics of the chip, and use conventional testing instruments such as oscilloscopes, multimeters, and logic analyzers to test the chips. [0004] The second is to use foreign automatic chip testers to complete chip testing by writing test programs to control the tester. [0005] The third is to use the PXI board produced by NI to form a virtual instrument, and program the chip thr...

AI Technical Summary

Problems solved by technology

[0006] The first method, although the cost is low, can be realized in the laboratory, but the testers need to manually detect each test point. For the situation where there are many test points and test items, it is easy to cause wrong judgment, inaccurate measurement, and low efficiency. high

The second method is mostly used for production testing of mass products. Although foreign chip automatic testers have fast testing speed and comprehensive testing, they are expensive and costly to use and maintain.

However, virtual instruments do not have a chip tester architecture. To achieve chip testing of various parameters, a combination of PXI boards with different functions is required. Therefore, virtual instruments are only suitable for testing certain parameters in small and medium-scale test chips. , and for the full parameter testing of complex digital integrated circuits with a large number of pins, virtual instruments cannot meet the requirements

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