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Double-component high heat-conducting pouring sealant with excellent mechanical properties and preparation method thereof

A potting glue, two-component technology, applied in the direction of chemical instruments and methods, adhesives, other chemical processes, etc., can solve the problem of reduced fluidity, and achieve the effect of improving impact resistance, high thermal conductivity, and excellent mechanical properties

Active Publication Date: 2014-06-04
TONSAN ADHESIVES INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to overcome the problem of reduced fluidity caused by the use of general thermally conductive fillers with a large filling amount. Spherical thermally conductive fillers are selected, and the filling amount of thermally conductive fillers is increased without affecting fluidity through particle size compounding. To obtain higher thermal conductivity; at the same time, through the combined use of single-terminated vinyl silicone oil and hydrogen-terminated polysiloxane, the bulk mechanical properties of the potting compound are optimized and improved

Method used

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  • Double-component high heat-conducting pouring sealant with excellent mechanical properties and preparation method thereof

Examples

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preparation example Construction

[0033] The preparation method of component A is: add 145 parts of polyorganosiloxane with a viscosity of 200mpa·s at 25°C and 1 part of 2000ppm Pt complex catalyst into a planetary stirring tank, and when the vacuum degree is greater than 0.095MPa, control Stir for 20 minutes at a temperature of 50-60°C, mix evenly to remove air bubbles; add 300 parts of mixed spherical alumina with an average particle size of 30 μm and 7 μm in a ratio of 1:1 to the stirring tank, and in a vacuum greater than 0.095 MPa Stir for 60min under the condition, and finally component A can be obtained.

[0034] The preparation method of component B is: 135 parts of polyorganosiloxane with a viscosity of 200mpa·s at 25°C, 10 parts of hydrogen-containing polysiloxane with a hydrogen content of 0.25%, 1,3,5,7-tetra Add 0.1 part of vinyl-1,3,5,7-tetramethylcyclotetrasiloxane inhibitor into the planetary stirring tank, stir for 20min under the condition of vacuum degree greater than 0.095MPa, temperature c...

Embodiment 1

[0036] The preparation method of component A is: 120 parts of polyorganosiloxane with a viscosity of 200mpa·s at 25°C, 25 parts of mono-capped vinyl silicone oil with a viscosity of 1000mpa·s at 25°C, and 2000ppm of Pt complex Add 1 part of the catalyst to the planetary stirring tank, stir for 20 minutes under the conditions of vacuum degree greater than 0.095MPa, temperature control 50-60°C, mix evenly and debubble; mix the average particle size of 30μm and 7μm in a ratio of 1:1 Add 300 parts of spherical alumina into the stirred tank, and stir for 60 minutes under the condition that the vacuum degree is greater than 0.095 MPa, and finally component A can be obtained.

[0037]The preparation method of component B is: 100 parts of polyorganosiloxane with a viscosity of 200mpa·s at 25°C, 30 parts of hydrogen-containing polysiloxane with a hydrogen content of 0.25%, and a terminal hydrogen group with a hydrogen content of 0.18% 15 parts of polysiloxane and 0.1 part of 1,3,5,7-te...

Embodiment 2

[0039] The preparation method of component A is: 105 parts of polyorganosiloxane with a viscosity of 200mpa·s at 25°C, 40 parts of mono-capped vinyl silicone oil with a viscosity of 1000mpa·s at 25°C, and 2000ppm of Pt complex Add 1 part of the catalyst to the planetary stirring tank, stir for 20 minutes under the conditions of vacuum degree greater than 0.095MPa, temperature control 50-60°C, mix evenly and debubble; mix the average particle size of 30μm and 7μm in a ratio of 1:1 Add 1,000 parts of spherical alumina into the stirred tank, stir for 90 minutes under the condition of a vacuum greater than 0.095 MPa, and finally obtain component A.

[0040] The preparation method of component B is: 100 parts of polyorganosiloxane with a viscosity of 200mpa·s at 25°C, 15 parts of hydrogen-containing polysiloxane with a hydrogen content of 0.25%, and a terminal hydrogen group with a hydrogen content of 0.18% 30 parts of polysiloxane and 0.1 part of 1,3,5,7-tetravinyl-1,3,5,7-tetrame...

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Abstract

The invention relates to a double-component high heat-conducting pouring sealant with excellent mechanical properties and a preparation method thereof. The pouring sealant comprises components A and B in a weight mixing ratio: 1:1, wherein the component A comprises 100-120 parts of polysiloxane, 15-45 parts of mono-blocked vinyl silicone oil, 0.1-5 parts of catalyst and 200-1200 parts of heat-conducting filler; the component B comprises 100 parts of polysiloxane, 10-40 parts of hydrogen-containing polysiloxane, 5-25 parts of hydrogen-terminated polysiloxane, 0.05-1 part of inhibitor and 200-1200 parts of heat-conducting filler. According to the sealant provided by the invention, spherical heat-conducting filler is selected, and the loading level of the heat-conducting filler is increased under the premise of not affecting the flowability through grain size compounding, so that a higher heat-conducting performance is obtained. The mono-blocked vinyl silicone oil and hydrogen-terminated polysiloxane are added into the system, and the mechanical properties (hardness and elongation at break) can be adjusted by changing the content of the mono-blocked vinyl silicone oil and hydrogen-terminated polysiloxane, so that performances such as impact resistance and crack resistance are further improved. Finally, the high heat-conducting pouring sealant with excellent mechanical can be obtained.

Description

technical field [0001] The invention relates to a high thermal conductivity potting glue. On the one hand, the potting glue is compounded with spherical heat-conducting fillers with different particle sizes to ensure the fluidity of the potting glue as much as possible while improving the thermal conductivity; on the other hand, adding single-capped ethylene Based silicone oil and hydrogen-terminated polysiloxane, excellent mechanical properties are obtained by reducing hardness. Background technique [0002] With the development of integration technology and assembly technology, electronic components and logic circuits tend to be denser and miniaturized, and the heat generation also increases accordingly. If the heat cannot be conducted in time, it is easy to form local high temperature, which may damage components and components. At the same time, in order to prevent the intrusion of moisture, dust and harmful gases to electronic components, slow down vibration, and preven...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/04C09J183/07C09J183/05C09J11/04C09K3/10
Inventor 王吉刘贵培
Owner TONSAN ADHESIVES INC
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