Heat conduction graphite paster for adhesive tape and preparing method of heat conduction graphite paster

Abstract

The invention discloses a heat conduction graphite paster for adhesive tape and a preparing method of the heat conduction graphite paster. The surface of the heat conduction graphite paster is coated with a heat conduction adhesive layer, the heat conduction graphite paster is composed of a polyimide film, a first coating layer and a second coating layer, and the first coating layer and the second coating layer are located on the upper surface and the lower surface of the polyimide film respectively. The first coating layer and the second coating layer respectively comprise, by weight, 20-25 parts of benzophenone tetracid dianhydride, 12-18 parts of pyromellitic acid dianhydride, 20-28 parts of diaminodiphenylmethane, 20-25 parts of dimethyl formamide, 8-10 parts of N-methyl pyrrolidone, 1.5-2.5 parts of ethylene glycol, 2-3 parts of dimethyl silicone polymer and 0.8-1.5 parts of phthalic acid dibutyl ester. According to the heat conduction graphite paster, local overheating is avoided, the evenness of the heat conduction performance is achieved, the stability and reliability of the heat dissipation performance of the heat conduction graphite paster are improved, and the cost of the heat conduction graphite paster is reduced.

Description

technical field [0001] The invention relates to a heat-conducting graphite patch used for an adhesive tape and a preparation method thereof, belonging to the technical field of graphite sheets. Background technique [0002] With the rapid development of modern microelectronics technology, electronic devices (such as laptops, mobile phones, tablet computers, etc.) are increasingly becoming ultra-thin and lightweight. This structure makes the internal power density of electronic devices significantly increased, and the heat generated during operation is not easy to discharge , Easy to accumulate rapidly and form high temperature. On the other hand, high temperatures can reduce the performance, reliability and lifespan of electronic equipment. Therefore, the current electronics industry has put forward higher and higher requirements for heat dissipation materials as the core components of thermal control systems, and there is an urgent need for a highly efficient heat-conducti...

AI Technical Summary

Problems solved by technology

[0003] In the prior art, polyimide films are mostly used for flexible circuit boards. Although polyimide films are sintered to obtain graphite heat sinks, which can be pasted on heat sources, they are limited by the quality and quality of polyimide films. The performance is uneven, which affects the heat dissipation performance of the heat dissipation double-sided film. There are the following technical problems: uneven heat dissipation, prone to local overheating of the tape, improved product heat dissipation performance instability, poor reliability performance, and is not conducive to product quality control. affect product competitiveness

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