Dielectric protective film of plasma display panel, preparation method of dielectric protective film, plasma display panel

A plasma display and dielectric protective film technology, which is applied in the direction of AC plasma display panels, discharge tube/lamp manufacturing, cold cathode manufacturing, etc., can solve the problems of low luminous efficiency and high discharge voltage of plasma display screens, and achieve low investment in transformation, High luminous efficiency, simple process to realize the effect

Inactive Publication Date: 2014-04-30
SICHUAN COC DISPLAY DEVICES
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present invention aims to provide a dielectric protective film for a plasma display to solve the problems of low luminous efficiency and high discharge voltage of the plasma display in the prior art

Method used

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  • Dielectric protective film of plasma display panel, preparation method of dielectric protective film, plasma display panel
  • Dielectric protective film of plasma display panel, preparation method of dielectric protective film, plasma display panel

Examples

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Embodiment 1

[0032] The base material of the dielectric protective film is magnesium oxide, and the total dielectric protective film thickness is set to 800 nm, and 20 magnesium oxide layers are alternately arranged, and the thickness of each layer is 40 nm. An electrode material layer is formed on the front substrate, a dielectric layer is prepared on the electrode material layer, and then a dielectric protective film is formed on the dielectric layer: First, under oxygen-free conditions, the magnesium oxide layer is formed by electron beam evaporation, and the thickness is measured by crystals The instrument controls the thickness of the magnesium oxide layer; when the thickness reaches 20nm, open the oxygen valve to pass in 30SCCM oxygen to carry out the evaporation of the magnesium oxide layer under aerobic conditions; repeat the above steps to perform alternate evaporation of oxygen-free and aerobic , Get a dielectric protective film. After the previous substrate and the rear substrate...

Embodiment 2

[0034] The base material of the dielectric protective film is magnesium oxide, the electrode material layer is formed on the front substrate, the dielectric layer is prepared on the electrode material layer, and then the protective film is formed on the dielectric layer: After the front substrate enters the evaporation chamber, first, proceed to 30 The magnesium oxide layer is formed by ion beam evaporation under anaerobic conditions for 2 seconds; then, open the oxygen valve to pass in 45SCCM oxygen, and the oxygen pass for 30 seconds, then shut off the valve; repeat the above steps until the final thickness reaches 800nm, the evaporation is over . After the previous substrate and the rear substrate are combined, they are sealed by a sealing process, and then filled with working gas, and then subjected to a sophisticated test to measure the discharge voltage.

Embodiment 3

[0036] The base material of the dielectric protection film is Ca-doped magnesium oxide. The total dielectric protection film thickness is set to 1000 nm. The 34 magnesium oxide layers are arranged alternately, each with a thickness of 30 nm. An electrode material layer is formed on the front substrate. A dielectric layer is prepared on the electrode material layer, and then a protective film is formed on the dielectric layer: First, under oxygen-free conditions, the magnesium oxide layer is formed by electron beam evaporation, and the thickness of the magnesium oxide layer is controlled by a crystal thickness gauge; when the thickness reaches At 30nm, the oxygen valve is opened and 30SCCM oxygen is introduced to perform the vapor deposition of the magnesium oxide layer under aerobic conditions; the above steps are repeated to perform alternate vapor deposition of oxygen-free and aerobic to obtain a dielectric protective film. After the previous substrate and the rear substrate a...

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Abstract

The invention provides a dielectric protective film of a plasma display panel, a preparation method of the dielectric protective film, and a plasma display panel comprising the dielectric protective film. According to the preparation method of the dielectric protective film, an intermittent oxygen aeration technique is adopted in the manufacture process of the dielectric protective film, such that a dielectric protective film with a plurality of magnesium oxide layers can be obtained. According to the preparation method of the invention which is simple in process, only a system for controlling oxygen flow and ventilation time is required to be additionally arranged on existing equipment, and the preparation method can be realized under the premise that the structure of the equipment is not modified basically, and therefore, modification investment on processing equipment can be low. The dielectric protective film obtained through adopting the preparation method of the invention has the plurality of magnesium oxide layers, and the degree of crystallinity of magnesium oxide layers which are formed under an oxygen aeration condition is high, and magnesium oxide layers which are formed under an anaerobic condition are compact, and therefore, the plasma display panel comprising the dielectric protective film can have high luminous efficiency under low voltage.

Description

Technical field [0001] The present invention relates to the field of gas discharge technology, in particular to a dielectric protective film of a plasma display and a preparation method thereof and a plasma display containing the same. Background technique [0002] Plasma display (PDP) is a display that uses gas discharge to generate ultraviolet rays, which in turn excite phosphors to emit visible light and display images. The plasma display panel is the main structure to realize discharge light emission. It is composed of two substrates before and after. On the front substrate, there are horizontal sustain electrodes and scan electrodes, as well as the dielectric layer and dielectric protection film above; on the rear substrate, Vertical address electrodes and barrier rib structures are provided, and discharge occurs in the space formed by the front and rear substrates and barrier ribs. The discharge performance of the plasma display determines the brightness, light efficiency,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01J9/02H01J11/40H01J11/10
Inventor 罗向辉邢芳丽
Owner SICHUAN COC DISPLAY DEVICES
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