Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Methods and device for scheduling production of semiconductor products

A technology of production scheduling and scheduling methods, which is applied in the direction of instruments, manufacturing computing systems, data processing applications, etc., and can solve problems such as the impact of release strategies

Inactive Publication Date: 2014-04-02
ZHEJIANG UNIV
View PDF3 Cites 12 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing semiconductor production scheduling methods mostly focus on how to optimize the processing sequence (assignment strategy) of the front lot (basic production unit composed of multiple wafers) of the processing machine group so that the final production performance indicators (average production cycle, WIP inventory, etc.) is optimal, while ignoring the release strategy of the lot (basic production unit composed of multiple wafers), that is, the amount of lot processed from a certain machine group on the production line will also affect these production performance indicators (Average lead time, WIP inventory, etc.)

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Methods and device for scheduling production of semiconductor products
  • Methods and device for scheduling production of semiconductor products
  • Methods and device for scheduling production of semiconductor products

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0079] In order to clearly understand the semiconductor product production scheduling method of the embodiment of the present invention, figure 1 shows a simplified semiconductor production wafer layered flow model, in this layered flow model, there are five machine groups M 1 , M 2 , M 3 , M 4 and M 5 , process 3 different types of product lot 1 、lot 2 、lot 3 . The production process for each product is:

[0080] In->M 1 -> M 3 -> M 5 -> M 4 -> M 2 -> M 5 ->out.

[0081] It can be seen from the production process that each product has to pass through the machine group M 5 Twice, that is, for machine group M 5 Each product has two layers.

[0082] In the production process of semiconductor products, when the production line is in a steady state, for a certain layer of a certain machine group, for example, for the k-th layer of the j-th machine group, the product lot of the i-th product type i Within the predetermined time interval [t, t+Δt], the number of lot...

Embodiment 2

[0138] combine Figure 4 The semiconductor product production scheduling method according to Embodiment 2 of the present invention will be described in detail.

[0139] The semiconductor production scheduling method includes the following steps:

[0140] S41, obtain the current load I of the current lot quantity on the production line to the production line curr :

[0141] First of all, it needs to be explained that the load is the sum of the processing time on all machine groups from the current lot on the production line to the bottleneck machine group for the first time. Therefore, the current lot quantity on the production line is related to the current load I of the production line curr has the same dimension as time. The bottleneck machine group is a preset machine group. On a production line, multiple bottleneck machine groups can be set up. The machines in the bottleneck machine group are defined as those machines whose actual processing capacity is less than the...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a method and a device for scheduling production of semiconductor products, which are used for controlling the distribution of to-be-processed lots in the production process of semiconductor products, and also provides a method for scheduling the production of the semiconductor products, which is used for controlling the material feeding in the production process of the semiconductor products. The methods and the device for scheduling the production of the semiconductor products are based on the concept of processing the middle layer of each semiconductor, and the processed product leaves off a machine table unit after being processed on the machine table unit, namely that the processed product is released on the machine table unit. The methods and the device for scheduling the production of the semiconductor products have the advantages that through considering the influence on the distribution processing of the to-be-processed products by the releasing of the to-be-processed products on the machine table unit, the inventory of in-process products is well controlled, the average production cycle of the semiconductor products is shortened, and the inventory square of in-process products is reduced.

Description

technical field [0001] The invention relates to the field of production automation scheduling, in particular to a semiconductor production scheduling method and device. Background technique [0002] In recent years, with the wide application of VLSI technology and the rapid progress of related information and communication electronics industries, the semiconductor industry has flourished. As an emerging strategic industry, the technological level and development scale of the semiconductor industry have become an important symbol to measure a country's economic development and technological progress, and it has a huge impact on and promotion of the country's comprehensive strength. [0003] The semiconductor manufacturing process is considered to be one of the most complex manufacturing processes today, with the characteristics of long production cycle, reentrant, reprocessing, high production uncertainty, and optimization of multiple production indicators. These characteris...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G06Q50/04
CPCY02P90/30
Inventor 潘再生丁进吕勇哉陈鹏
Owner ZHEJIANG UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com