Circuit board heat conduction optimization design structure for onboard aviation product

Abstract

The invention provides a circuit board heat conduction optimization design structure for an onboard aviation product. A heat-conductive board is arranged between a high-power highly-heat-radiating device and a PCB. The heat-conductive board is directly and additionally arranged on the PCB, so that the heat dissipation area is greatly increased; meanwhile, a soft silica gel heat-conductive fin is additionally arranged between the high-power highly-heat-radiating device and a heat-conductive aluminum plate so that an air gap can be eliminated, thermal contact resistance between the device and the heat-conductive aluminum plate can be reduced, and heat generated by the device can be rapidly conducted to the heat-conductive aluminum plate. A T-shaped structure of a heat-conductive and radiation heat exchange face is additionally arranged at the top of the heat-conductive aluminum plate. After the soft silica gel heat-conductive fin is additionally arranged on the upper end face of the T-shaped structure, the T-shaped structure is connected with a box body sealing cover into a whole, so that heat is effectively conducted to the surface of a box body, and the heat dissipation area is increased. A wedge-shaped pressing mechanism is adopted, so that the contact area between the heat-conductive aluminum plate and the box body is increased, heat conduction is effectively achieved, the temperature of the surface of an electronic device is rapidly lowered, and the service life of the product is prolonged.

Description

technical field [0001] The invention belongs to the technical field of thermal design of aviation products, and in particular relates to a circuit board thermal conduction optimization design structure for airborne aviation products. Background technique [0002] With the development of electronic products and the continuous enhancement of the integration of various subsystems, the power consumption of the system continues to increase, while the volume of the box body continues to decrease, resulting in increasing heat generation of circuit board devices, which directly affects the performance of the devices, resulting in product life. , Reduction of reliability. In addition, since the high-temperature ambient temperature of airborne aviation products is generally required to be 70°C, and the internal temperature of the product box is much higher than the ambient temperature, and the temperature will continue to increase with the accumulation of working hours, if the interna...

AI Technical Summary

Problems solved by technology

At present, airborne aviation products continue to require miniaturization, light weight, high and low temperature resistance, heat and humidity resistance and high strength, which determines that the chassis must be a fully sealed chassis, natural wind cooling, direct liquid cooling, evaporative cooling methods, thermoelectric refrigeration methods and The cooling method of heat pipe technology has poor realizability or cannot meet the heat dissipation needs, so it is necessary to improve

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