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Laser drilling method of FPC

A laser drilling and laser technology, applied in laser welding equipment, welding/welding/cutting items, manufacturing tools, etc., to achieve the effects of improving efficiency, reducing processing costs, and reducing costs

Inactive Publication Date: 2014-03-26
SUZHOU SUNSHINE LASER & ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem solved by the present invention is to provide a laser drilling method for FPC that can reduce costs, improve performance, and effectively overcome the problems of Teflon materials in view of the current problems of high cost and low efficiency of FPC.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] Embodiment 1, a kind of laser drilling method of FPC, uses CO2 laser drilling machine, comprises the following steps:

[0017] S1. Turn on the laser drilling machine and determine the size of the mask. The size of the mask MASK is calculated according to the beam diameter Beam Size. The calculation formula is MASK=Beam Size / 0.303, where the unit of MASK is mm, and the unit of Beam Size is um. The size of the Beam Size is the processing diameter of the FPC. At this time, the processing diameter of the FPC is 100um, and the size of the mask MASK is 1.6mm;

[0018] S2. Set the output power of the laser to 5100W, the frequency of the laser to 90Hz, and the pulse width of the laser to 12us. The CO2 laser drilling machine will automatically adjust the position of the light collecting mirror according to the parameters of the mask MASK and the laser;

[0019] S3. Debug the laser emitting device. The laser drilling adopts the method of double-sided drilling on the front and bac...

Embodiment 2

[0020] Embodiment 2: It differs from Embodiment 1 in that the output power of the laser in step S2 is 5900 W, the frequency of the laser is 100 Hz, and the pulse width of the laser is 13 us.

Embodiment 3

[0021] Embodiment 3: The difference from Embodiment 1 lies in that the output power of the laser in step S2 is 5600 W, the frequency of the laser is 100 Hz, and the pulse width of the laser is 15 us.

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Abstract

The invention discloses a laser drilling method of an FPC. The laser drilling method of the FPC adopts a CO2 laser drilling machine and comprises the following steps of S1, starting the laser drilling machine and confirming the size of a mask; S2, setting laser parameters, wherein the output power is 5100-5900W, the laser frequency is 90-110Hz, the laser pulse width is 67-107ms, and the CO2 laser drilling machine automatically adjusts the position of a condenser according to the mask and the laser parameters; S3, debugging a laser transmitting device to perform laser drilling, wherein the laser drilling mode is a front and back side drilling mode, the front and back sides are consistent in laser parameter, and the front and back side laser transmitting times is set to be 2. By adopting the laser drilling method of the FPC, the cost can be reduced, and the efficiency can be improved. The laser drilling method is applicable to special materials, such as a Teflon material.

Description

technical field [0001] The invention relates to a laser drilling method, in particular to a laser drilling method for FPC. Background technique [0002] FPC is the abbreviation of Flexible Printed Circuit, also known as flexible circuit board, flexible printed circuit board, flexible circuit board, referred to as soft board. Mainly used in mobile phones, notebook computers, PDAs, digital cameras, LCM and other products, FPC flexible printed circuit is a kind of highly reliable and excellent flexible printed circuit made of polyimide or polyester film. Flexible printed circuit has the characteristics of high linear density, light weight and thin thickness, but the processing cost is high and the cycle is long. [0003] At present, FPC on the market generally uses UV laser to drill holes. During the process of UV hole opening, if it encounters Teflon materials, it cannot be processed; at the same time, the efficiency of CO2 laser drilling is 3-5 times that of UV hole opening....

Claims

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Application Information

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IPC IPC(8): B23K26/382
CPCB23K26/382B23K2103/42B23K2103/50
Inventor 沈祺舜王荣
Owner SUZHOU SUNSHINE LASER & ELECTRONICS TECH CO LTD
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