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A kind of multi-layer heat pipe heat exchange semiconductor refrigeration system

A heat pipe heat exchange, semiconductor technology, applied in refrigerators, heating methods, air conditioning systems, etc., can solve the problems of high operating costs, refrigerant leakage environment, waste of electric energy, etc., to achieve long-distance heat transfer, saving cost, the effect of ensuring work stability

Active Publication Date: 2016-06-01
BEIJING FULLLINK OREITH TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, the air-conditioning system used to control the ambient temperature is mainly composed of indoor heat exchanger and outdoor heat exchanger. This air-conditioning system can realize the temperature regulation of the condensing agent through the high energy consumption of the compressor in the indoor heat exchanger, thereby indirectly changing the indoor temperature. Ambient temperature, this kind of air-conditioning system does not save energy very well, resulting in unnecessary waste of electric energy, high operating costs, and refrigerant leakage often occurs during use, causing pollution to the environment

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  • A kind of multi-layer heat pipe heat exchange semiconductor refrigeration system
  • A kind of multi-layer heat pipe heat exchange semiconductor refrigeration system

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Embodiment Construction

[0011] Such as figure 1 The schematic structural diagram of the multi-layer heat pipe heat exchange type semiconductor refrigeration system shown in the present invention includes a semiconductor refrigeration module group (1), an inner heat pipe condenser group (2), an inner heat pipe evaporator (3), an outer heat pipe evaporator Group (4), external heat pipe condenser (5), fan (6) of external heat pipe condenser, fan (7) of internal heat pipe evaporator, air guide tube, liquid guide tube and control circuit; the internal heat pipe evaporator The fan (7) is installed on the inner heat pipe evaporator (3); the fan (6) of the outer heat pipe condenser is installed on the outer heat pipe condenser (5); the inner heat pipe condenser group (2) includes multiple inner The heat pipe condenser; the external heat pipe evaporator group (4) includes a plurality of external heat pipe evaporators; the semiconductor refrigeration module group (1) includes at least two groups of semiconduct...

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Abstract

The invention discloses a multilayer heat pipe heat exchange type semiconductor refrigeration system. The semiconductor refrigeration system mainly comprises a semiconductor refrigeration module group, an inner heat pipe condenser group, an inner heat pipe evaporator, an outer heat pipe evaporator group, an outer heat pipe condenser, a blower of the outer heat pipe condenser, a blower of the inner heat pipe evaporator, gas guiding pipes, liquid guiding pipes and control circuits, wherein the two sides of the inner heat pipe condenser are in close contact with the refrigerating surfaces of two groups of semiconductor refrigeration chips; the two sides of the outer heat pipe evaporator are in close contact with the heating surfaces of the two groups of semiconductor refrigeration chips; the inner heat pipe condenser group is connected with the inner heat pipe evaporator to form an inner gravity heat pipe system; the outer heat pipe condenser is connected with the outer heat pipe evaporator group to form an outer gravity heat pipe system. According to the invention, the radiating areas of the semiconductor refrigeration surfaces and heating surfaces are increased through the gravity heat pipe heat transfer technology to change the indoor environmental temperature; as the semiconductor refrigeration chips replace compression refrigerants for refrigeration, safety, reliability and no environmental pollution are realized.

Description

technical field [0001] The invention belongs to the technical field of cold and heat energy transportation, and relates to a multilayer heat pipe heat exchange type semiconductor refrigeration system which combines a heat pipe heat exchange system and a semiconductor semiconductor refrigeration sheet to carry out cold and heat energy transportation. Background technique [0002] At present, the air-conditioning system used to regulate the ambient temperature is mainly composed of indoor heat exchanger and outdoor heat exchanger. This air-conditioning system can realize the temperature regulation of the condensing agent through the high energy consumption of the compressor in the indoor heat exchanger, thereby indirectly changing the indoor temperature. Ambient temperature, this kind of air-conditioning system does not save energy very well, which leads to unnecessary waste of electric energy, high operating costs, and refrigerant leakage often occurs during use, causing pollu...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F24F5/00F24F13/30F25B21/02F28D15/02F25B39/02F25B39/04
Inventor 祝长宇丁式平
Owner BEIJING FULLLINK OREITH TECH CO LTD
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