Electrostatic protection method and structure for under-plate type microphone

Abstract

The invention relates to the technical field of electrostatic protection and discloses an electrostatic protection method and structure for an under-plate type microphone. The electrostatic protection method and structure for the under-plate type microphone are used for a cell phone with the internally-arranged under-plate microphone. A through hole corresponding to the microphone and penetrating to the outside of the cell phone is formed in an outer shell of the cell phone. A PCB plate is arranged in the cell phone. A voice inlet hole communicated with the microphone and the through hole is formed in the PCB plate. A cushion ring electrically connected with the PCB plate is attached to the edge of one end of the voice inlet hole through SMT (surface mount technology). According to the electrostatic protection method and structure, the cushion ring is arranged in the voice inlet hole in the PCB plate through the SMT, complete grounding of the voice inlet hole is realized, the static electricity outside the cell phone is guided onto the PCB plate through the cushion ring before entering the microphone to realize ground connection, so that the outside static electricity is prevented from entering the microphone to damage a chip, and the service life of the microphone is prolonged.

Description

technical field [0001] The invention relates to the technical field of electrostatic protection, in particular to an electrostatic protection method and structure of an under-board microphone. Background technique [0002] Silicon MICs (microphones) are commonly used in mobile phones, while under-board silicon MICs are used relatively more. Usually, the sound inlet holes of the under-board silicon MIC are set under the device body, which leads to the fact that after the silicon MIC is soldered on the PCB, it is often necessary to drill mechanical holes on the PCB for sound output. The sound inlet is not grounded, so that the static electricity outside the mobile phone can enter the MIC body through the sound inlet, and damage the chip; for the board-type silicon MIC, the sound inlet is set on the silicon MIC. On the shell, since the shell is grounded, there is no problem of static electricity entering the silicon MIC body and damaging the internal chip. [0003] At present...

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to provide an electrostatic protection method and structure of an under-board microphone, which aims to solve the problem that in the prior art, the common under-board microphone exists, and external static electricity easily enters the microphone through the sound inlet hole on the PCB. Defects that damage the chip

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