Data collection implementation method of semiconductor manufacturing equipment

Abstract

The invention relates to a data collection implementation method of semiconductor manufacturing equipment. The data collection implementation method comprises the steps: respectively building a Web service at a client terminal and an equipment server terminal, enabling a proxy class to be used in Web communication, conducting client safety certification based on a security socket layer, defining a SOAPHeader data format, building an equipment information database, using an agent entrustment mode to process various abnormal events in the equipment, building a state machine of a data collection plan, achieving behavior conversion on the data collection plan, and using a COM assembly to complete connection between the equipment terminal and an equipment control system. According to the data collection implementation method, a general equipment data collection method is provided for semiconductor manufacturing, and the data collection capacity between a producer and the equipment in a plant in semiconductor production and manufacturing is improved.

Description

technical field [0001] The invention belongs to semiconductor equipment communication technology, in particular to a method for realizing data collection for semiconductor manufacturing equipment. Background technique [0002] As the production of semiconductor integrated circuits develops towards the production of 300mm wafers, the data demand for semiconductor manufacturing equipment increases sharply, and the equipment is further required to support a series of "Equipment Engineering Capabilities", such as E- Diagnosis, data acquisition, recipe management, fault detection and classification, Run-To-Run control and other upper-level applications. The most important factor to realize these applications is to obtain various device data. Therefore, more and higher-quality data are urgently needed to support accurate manufacturing of equipment and optimize factory automation. [0003] At present, the data collection of semiconductor equipment mainly relies on the SECS / GEM co...

AI Technical Summary

Problems solved by technology

[0003] At present, the data collection of semiconductor equipment mainly relies on the SECS / GEM communication method, but as 300mm wafer processing becomes the mainstream, the SECS / GEM communication method cannot meet the needs of current equipment and user data collection

SECS / GEM communication lacks a secure communication mechanism and cannot guarantee communication security; it can only support one user for data collection; it only has the self-description function of some devices, and the obtained device data is very little and of low quality

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