Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Technology for treating electronic circuit board manufacturing process waste water

A technology of electronic circuit board and production process, which is applied in the field of waste water treatment of electronic circuit board production process, can solve the problems of difficult manual treatment, complex wastewater composition, waste of resources, etc., to solve serious COD exceeding the standard, improve resource utilization efficiency, The effect of preventing heavy metal poisoning

Active Publication Date: 2014-01-01
ANHUI GREEN TITAN ENVIRONMENTAL TECH
View PDF7 Cites 10 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the production process of printed circuit boards, a variety of wastewater containing heavy metal pollutants and high-concentration organic wastewater are discharged. If they are not treated, they will inevitably cause great harm to the environment.
Due to the complex composition of these wastewaters, large pH value changes, manual treatment is very difficult, and the water quality after treatment is low, especially in large-scale production plants, the shortcomings of manual treatment are more obvious
[0003] The waste water in the production process of printed circuit boards has a strong recycling value due to the high content of certain metals. The heavy metal ions and fluorine in the effluent after treatment by traditional methods such as electrolytic oxidation and activated carbon adsorption cannot meet the standards stably, which is harmful to the water resource environment. pollution, and the waste of resources is becoming more and more serious

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0022] The present invention will be further described in detail below in conjunction with specific embodiments.

[0023] The treatment process of high-concentration, refractory, toxic and harmful wastewater produced in the production process of electronic circuit boards includes the use of chemical coagulation flocculation reaction, biological contact oxidation, and reverse osmosis process systems, among which,

[0024] Wastewater quality can be specifically divided into the following four categories of analysis:

[0025] 1. Organic and oily wastewater (referred to as organic wastewater)

[0026] CODcr: 400—1000 mg / L; PH: 8—12

[0027] SS: 100-200 mg / L; Chromaticity: 1000-1500 times.

[0028] The organic wastewater generated in the dry film, development, degreasing and other sections flows into the organic wastewater collection tank with oil separation function, and NaOH is added to the rear section of the collection tank to adjust the pH value of the wastewater to weak alk...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a technology for treating electronic circuit board manufacturing process waste water. The technology includes the steps that the waste water enters an inclined tube sedimentation tank after being pretreated, solid-liquid separation of the waste water is realized in the inclined tube sedimentation tank, and supernatant liquid enters a comprehensive waste water equalization tank to be regulated to be neutral in PH; the waste water enters a hydrolytic acidification tank, macromolecular organic matter is degraded into micromolecular organic matter, and the micromolecular organic matter is degraded into acetic acid, hydrogen and carbon dioxide; the waste water enters a biological contact oxidation tank, and the organic matter in the waste water is degraded by aerobe; sludge is produced in the biological contact oxidation tank and enters a secondary sedimentation tank along with the waste water, sludge-water separation is realized in the secondary sedimentation tank, the supernatant liquid enters a reverse osmosis system after being filtered by a pressure filter, and the sludge is drained to a sludge concentration tank. According to the technology, reasonable and thorough diversion connection and pretreatment are carried out on the waste water in different production processes. Besides, metal ions like copper are effectively removed, therefore, the situation that the metal ions like the copper accumulate in follow-up systems is avoided, and the phenomenon that microorganisms suffer from heavy metal poisoning is prevented.

Description

technical field [0001] The invention relates to the treatment of waste water in the field of electronic semiconductor industry, in particular to a treatment process of waste water in the production process of electronic circuit boards. Background technique [0002] With the rapid development of the electronics industry, the output of printed circuit boards, which is the basis of the electronics industry, is increasing at an annual rate of 10-20%, becoming one of the important industries in the electronics industry. However, many kinds of wastewater containing heavy metal pollutants and high-concentration organic wastewater are discharged during the production process of printed circuit boards. If they are not treated, they will definitely cause great harm to the environment. Due to the complex composition of these wastewaters and the large changes in pH value, manual treatment is very difficult, and the rate of water quality after treatment is low. Especially in large-scale ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C02F9/14
Inventor 姚明胡召堂赵晓刚李双建
Owner ANHUI GREEN TITAN ENVIRONMENTAL TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products