Integrated type both-way ultra-low capacitance TVS device and manufacturing method thereof
A manufacturing method and integrated technology, applied in semiconductor/solid-state device manufacturing, electrical solid-state devices, electrical components, etc., to improve device quality and avoid defects
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0074] The integrated bidirectional ultra-low capacitance TVS device and its manufacturing method proposed by the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. Advantages and features of the present invention will be apparent from the following description and claims. It should be noted that all the drawings are in a very simplified form and use imprecise scales, and are only used to facilitate and clearly assist the purpose of illustrating the embodiments of the present invention.
[0075] This embodiment provides a method for manufacturing an integrated bidirectional ultra-low capacitance TVS device, including:
[0076] S10: providing a first conductivity type substrate;
[0077] S11: forming a first conductivity type epitaxial layer on the first conductivity type substrate;
[0078] S12: forming a second conductivity type buried layer in the first conductivity type epitaxial layer;
[0...
PUM
Property | Measurement | Unit |
---|---|---|
Resistivity | aaaaa | aaaaa |
Resistivity | aaaaa | aaaaa |
Thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com