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High flexibility epoxy resin composition

An epoxy resin and flexibility technology, applied in epoxy resin coatings, coatings, powder coatings, etc., can solve the problem of inability to encapsulate electronic components with thermal shock resistance, insufficient epoxy resin toughness, and easy cracks. problem, to achieve the effect of improving thermal shock resistance, strong environmental protection, and improving flexibility

Active Publication Date: 2013-12-25
天津凯华绝缘材料股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] However, due to the lack of toughness of pure epoxy resin, the cured substance is brittle and prone to defects such as cracks, so it cannot be used for the packaging of electronic components that require high thermal shock resistance, and its application has been greatly restricted.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] A kind of epoxy resin composition with high flexibility, the specific components and consumption are shown in Table 1, and the preparation method is as follows:

[0028] Mix epoxy resin (E-12), polyvinyl butyral PVB (I), curing agent, curing accelerator and inorganic filler according to the ratio of parts by mass. The mixing time is 5-20 minutes, and the speed is 500- 1000r / min; then melt and knead and extrude (extrusion temperature 70-150°C, extruder speed 1500-3000r / min, feeding speed 900-2400r / min), and then crush and sieve to obtain the epoxy resin composition.

[0029] Among them, the specific parameters of polyvinyl butyral PVB (I) are: polyvinyl alcohol hydroxyl content of 21wt%, polyvinyl butyral content range of 78wt%, vinyl acetate content range of 1wt%, glass transition temperature Tg The range is 63°C.

Embodiment 2

[0031] A kind of epoxy resin composition with high flexibility, the specific components and consumption are shown in Table 1, and the preparation method is as follows:

[0032] Mix epoxy resin (E-12), polyvinyl butyral PVB (II), curing agent, curing accelerator and inorganic filler according to the ratio of parts by mass. The mixing time is 5-20 minutes, and the speed is 500- 1000r / min; then melt and knead and extrude (extrusion temperature 70-150°C, extruder speed 1500-3000r / min, feeding speed 900-2400r / min), and then crush and sieve to obtain the epoxy resin composition.

[0033] Among them, the specific parameters of polyvinyl butyral PVB (II) are: polyvinyl alcohol hydroxyl content of 25wt%, polyvinyl butyral content range of 74wt%, vinyl acetate content range of 1wt%, glass transition temperature Tg The range is 61°C.

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Abstract

The present invention provides a high flexibility epoxy resin composition, which can be used in the fields of electronic packaging materials and powder coating materials, and comprises, by mass, 30-50 parts of an epoxy resin, 1-30 parts of polyvinyl butyral (PVB), 3-10 parts of a curing agent, 0.05-0.3 part of a curing accelerator, and 30-60 parts of an inorganic filler. The epoxy resin has characteristics of excellent interpenetrating network structure and excellent flexibility, and can be used in the fields of electronic packaging materials and powder coating materials.

Description

technical field [0001] The invention belongs to the field of electronic packaging materials and powder coatings, and relates to an epoxy resin composition with high flexibility. Background technique [0002] Epoxy resin is one of the most widely used matrix resins in polymer-based composite materials. It is a product obtained by polycondensation reaction of compounds with epoxy groups and polyhydric hydroxyl or polyol compounds. It has excellent adhesion, resistance Chemical corrosion, electrical insulation properties, mechanical properties, and easy processing, low shrinkage, small coefficient of linear expansion, and low cost are widely used in the fields of electronic packaging materials and powder coatings. [0003] However, due to the lack of toughness of pure epoxy resin, the cured substance is brittle and prone to defects such as cracks, and cannot be used for the packaging of electronic components that require high thermal shock resistance, and its application has be...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L63/02C08L29/14C08K3/02C08K3/34C08K3/26C09D163/00C09D163/02C09D129/14C09D5/03
Inventor 沈纪洋任志成
Owner 天津凯华绝缘材料股份有限公司
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