Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Film capacitor element, film capacitor, and method of producing the film capacitor element

A film capacitor and thin film technology, applied in the direction of film/thick film capacitors, capacitors, electrical components, etc., can solve the problems of affecting the dielectric covering film layer and increasing the possibility of peeling off the dielectric covering film layer, so as to prevent adverse effects Effect

Inactive Publication Date: 2013-12-04
KOJIMA PRESS IND CO LTD
View PDF9 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the amount of oil required to adhere to the ends of the base dielectric film layer increases, and there is a risk that oil will adhere to the dielectric cover film layer while the film capacitor element is being taken out or fed from the reel, and adversely affect the dielectric. cover film layer
In addition, excessive amounts of oil attached to the dielectric cover film layer increase the likelihood of the dielectric cover film layer delaminating from the vapor deposited metal film layer

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Film capacitor element, film capacitor, and method of producing the film capacitor element
  • Film capacitor element, film capacitor, and method of producing the film capacitor element
  • Film capacitor element, film capacitor, and method of producing the film capacitor element

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0047] In order to further clarify the present invention, the embodiments of the present invention are described in detail by referring to the accompanying drawings.

[0048] figure 1 A film capacitor element 10 constructed in accordance with one embodiment of the present invention is shown in cross section. Such as figure 1 As shown, the film capacitor element 10 of the present embodiment has a resin film 12 as a base dielectric film layer, a vapor-deposited metal film layer as a vapor-deposited metal film layer formed on one of the opposite main surfaces of the resin film 12 in the thickness direction. film 14 and a vapor-deposited polymer film 16 as a dielectric capping film layer formed on the surface of the vapor-deposited metal film 14 remote from the resin film 12 . That is, the film capacitor element 10 of the present embodiment has a base dielectric film layer (resin film 12), a vapor-deposited metal film layer (vapor-deposited metal film 14), and a dielectric cover...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A film capacitor element including a base dielectric film layer 12, a vapor-deposition metal film layer 14 formed on the base dielectric film layer 12 and consisting of a first film portion 20 and a second film portion 22 that are spaced apart from each other by a margin portion 18, and a dielectric covering film layer 16 which is formed integrally on the second film portion 22 by vapor-deposition polymerization or coating and which has a covering portion 30 which fills the margin portion 18 and covers an entire area of an end face of the second film portion 22 on the side of the margin portion 18. The first film portion 20 including a non-covered portion 34 which is not covered by the dielectric covering film layer 16.

Description

[0001] This application is based on Japanese Patent Application No. 2012-119117 filed on May 25, 2012, the contents of which are incorporated herein by reference. technical field [0002] The present invention relates generally to a thin film capacitor element, a thin film capacitor and a method of manufacturing a thin film capacitor element, and more particularly to a method comprising polymerizing or coating by vapor deposition on at least one opposing major surface of a base dielectric thin film layer. A thin film capacitor element of an integrally formed vapor-deposited metal thin film layer and a dielectric covering thin film layer, a method of advantageously manufacturing the thin film capacitor element and a thin film capacitor obtained by using one or more of the thin film capacitor elements. Background technique [0003] Film capacitors have traditionally been used in a variety of electrical devices. There are two types of film capacitors: laminated film capacitors ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01G4/33H01G4/00H01G4/32H01G4/002
CPCH01G4/232H01G4/306H01G4/145H01G4/33H01G4/30
Inventor 寺岛旭人早川宗孝伊藤薰
Owner KOJIMA PRESS IND CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com