Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Optimization design method for semiconductor cooling module

An optimized design and refrigeration module technology, which is applied in computing, special data processing applications, instruments, etc., can solve the problems of poor flexibility, mathematical analysis and solution ability can not achieve accurate results, time-consuming and expensive, etc., to achieve economical and adaptable analysis process Effects on performance and solvency, large degrees of freedom and flexibility

Inactive Publication Date: 2013-11-27
UNIV OF ELECTRONICS SCI & TECH OF CHINA
View PDF2 Cites 6 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] In order to solve the problem that the previous theoretical calculation of the existing semiconductor refrigeration module design method cannot achieve accurate results due to the limitation of mathematical analysis and solving ability, the invention corrects the shortcomings of time-consuming and poor flexibility through the design and manufacturing model test, and proposes a software-implemented semiconductor Refrigeration module optimization design method

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Optimization design method for semiconductor cooling module
  • Optimization design method for semiconductor cooling module
  • Optimization design method for semiconductor cooling module

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0046] The present invention will be described in further detail below in conjunction with the accompanying drawings and embodiments.

[0047] The structure of the semiconductor refrigeration module involved in the optimal design method of the semiconductor refrigeration module in this embodiment is as follows: figure 1 and figure 2As shown, it mainly includes a multi-segment serpentine main flow channel 1. On both sides of the main flow channel 1, there are multi-segment serpentine auxiliary flow channels 2, flap cover plates 3 and TEC chipset 5 and other components symmetrically distributed. All roads are provided with water inlet / outlet 4. Among them, the TEC chipset 5 is the core component of the semiconductor refrigeration, which can cool the multi-segment serpentine main channel according to the Peltier effect.

[0048] A kind of semiconductor refrigeration module optimization design method of the present embodiment, comprises the following steps:

[0049] a. Optimiz...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to an optimization design method for a semiconductor cooling module. The method comprises the steps of a, optimizing a thermo electric cooler (TEC) chip to obtain an optimal reasonable parameter of the TEC chip; b, optimizing TCU module cooling component parameters according to the optimal reasonable parameter of the TEC chip to obtain an optimal reasonable structural parameter of the TCU module cooling component; c, optimizing a TCU module water-cooling circulation component according to the optimal reasonable structural parameter of the TCU module cooling component to obtain an optimal reasonable structural parameter of the TCU module. The optimization design method is not confined to the mathematical analysis ability, so that the large adaptability and the high solving capability are provided; compared with experiment research, the method has the advantages that solid models are not required to be manufactured, the analysis process is economic and rapid, the large freedom degree and the high flexibility are provided, and limits of experimental material conditions can be broken to obtain more detailed results.

Description

technical field [0001] The invention relates to the technical field of temperature control, in particular to the design of a semiconductor refrigeration module (TCU module), in particular to an optimal design method of a semiconductor refrigeration module. Background technique [0002] Temperature is one of the common process parameters in industrial production, and most physical and chemical changes are closely related to temperature. In many fields of scientific research and production practice, temperature control plays an extremely important role. Especially in metallurgy, chemical industry, building materials, food, machinery and petroleum industries, it plays a pivotal role. For temperature control under different production conditions and process requirements, the heating methods, fuels, and control schemes used are also different. The process of temperature control system is complex and changeable, with uncertainty, so more advanced control technology and control t...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G06F17/50
Inventor 曾志徐振源王皓于慧君彭倍黄洪钟李淼
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com